05. - 07.06.2018
SMT Hybrid Packaging 2018
System Integration in Micro Electronics
01.08.2017Call for Tutorials has startedInterested professionals can submit their abstract for the tutorials and short tutorials until 02 November 2017. Topics, deadlines and submission details are to be found in the Call for Tutorials.
17.07.2017Analysis is available now The analysis of SMT Hybrid Packaging 2017 is available now. Get a detailed overview of the exhibition.