16. - 18.05.2017
System Integration in Micro Electronics
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Welcome to SMT Hybrid Packaging 2016!
SMT Hybrid Packaging is the only event in Europe which takes a comprehensive view of system integration in microelectronics.
From the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies.
Call for Tutorials
The tutorials are designed to give profound solution-oriented knowledge about specific topics with the following focus points:
- Technologies & Processes
- Reliability, Test, Analysis
- Innovations & Trends
Share your experience with us and submit an abstract.
Deadline for the submission of your abstract is 4 October 2016.
SMT Hybrid Packaging 2016: Analysis
of SMT Hybrid Packaging 2016 is available now. Get a detailed overview of the exhibition.