16. - 18.05.2017
System Integration in Micro Electronics
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SMT Hybrid Packaging – Conference and Tutorials
SMT Hybrid Packaging is the only event in Europe which takes a comprehensive view of system integration in microelectronics.
From the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies.
SMT Hybrid Packaging offers conference and tutorials regarding the latest trends and solution opportunities from various fields of electronic assembly. Learn more about the range of topics the SMT Hybrid Packaging covers!
Download the Tutorial and Short-Tutorial Program here!
Register now and save money with the early bird rate!
The registration for the conference and the tutorials of SMT Hybrid Packaging is online now. Register
until 3 April 2017 and benefit from our early bird rate.
New Tutorial Concept and conference focus released
Beside the established conference and half-day Tutorials, short Tutorials with a duration of one and a half hours will be offered. Practical oriented topics for every kind of timetable await the participants! Program