05. - 07.06.2018
Nuremberg
SMT Hybrid Packaging 2018
System Integration in Micro Electronics

 
 
 

Topics Call for Tutorials 2018

  1. Interconnection technology – packaging, processing and materials
  2. Reliability and quality of assemblies, analytics
  3. Automation, organization and optimization (industry 4.0, smart electronic factory, digitization in electronics)
  4. System integration, system in package and panel level packaging
  5. Micro systems technology
  6. High-frequency and high-temperature assemblies
  7. Sensor systems and photonic assemblies
  8. Printed electronics, flex and rigid-flex assemblies
  9. Environment, energy efficiency and disposal
  10. Design, inspection and test

Main Focus

  1. Basics
  2. Technologies & Processes
  3. Reliability, Test, Analysis
  4. Innovations & Trends