05. - 07.06.2018
Nuremberg
SMT Hybrid Packaging 2018
System Integration in Micro Electronics

 
 
 

Conference Program SMT Hybrid Packaging 2018
Program available January 2018

The SMT Hybrid Packaging Conference is the most important platform for information and networking in the field of microelectronics manufacturing in Europe. International experts from industry and science

  • present current and future developments in electronics manufacturing
  • offer solutions for special problems
  • and are inviting all delegates to discuss and exchange their experiences.

For your preliminary reference please download the English program of
SMT Hybrid Packaging 2017

Do you have any questions or suggestions concerning the conference program?
Please contact Ms. Svenja Speidel by phone at +49 711 61946-974.