16. - 18.05.2017
Nuremberg
SMT Hybrid Packaging 2017
System Integration in Micro Electronics

 
 
 

SMT Hybrid Packaging 2017

The SMT Hybrid Packaging Conference 2017 provides practice oriented knowledge ranging from manufacturing electronic assemblies via design to reliability and quality management. Engineers and service provides will find an ideal platform for an intensive exchange of knowledge and experience.  

The program


Tuesday, 16.05.2017

Wednesday, 17.05.2017

Thursday, 18.05.2017