05. - 07.06.2018
Nuremberg
SMT Hybrid Packaging 2018
System Integration in Micro Electronics

 
 
 

Tutorial 7 (English)

Preventing SMT Assembly Defects and Product Failure

Schedule

Wednesday, 06.06.2018, 14:00 - 17:00 hrs

Room

Room Stockholm

Description

14:00 Preventing SMT Assembly Defects and Product Failure
Dr. Jennie Hwang, H-Technologies Group Inc., Bedford, USA
Focusing on preventing most prevailing SMT assembly production defects and product failures that affect yield, cost and reliability through an understanding of potential causes, two selected areas related to product failure (intermetallics and tin whisker) and five selected defects ( PCB pad cratering, BGA head-on-pillow, open or insufficient solder joints, copper dissolution issue and lead-free through-hole barrel filling) will be addressed. Specific defects associated with the reliability of BTC and PoP assembly will be highlighted. The tutorial summarizes the role of intermetallics at-interface and in-bulk (contributing from the PCB surface finish/component coating) in relation to product reliability, and the difference between SnPb and Pb-free solder joint in terms of intermetallic compounds, which in turn is attributed to production-floor phenomena and the actual field failure. From practical perspectives with emphasis on risk mitigation and the factors that affect tin whisker growth and its testing challenges will be outlined; also summarized are the practical tin whisker criteria in reliability implications in the lead-free environment and the relative effectiveness of mitigating measures. The tutorial provides a holistic overview of product reliability including the important roles of materials, processes and testing/service conditions. A relative reliability ranking among current solder alloys, as well as the scientific, engineering and manufacturing reasons behind the ranking will be summarized. The tutorial emphasizes on practical, working knowledge, yet balanced and substantiated by science. Attendees are encouraged to bring their own selected systems for deliberation.

Main Topics
- Premise of production defects and product failure prevention;
- Common production defects and issues in lead-free assembly;
- Product reliability ? principles;
- Product reliability ? solder joint, PCB and component considerations;
- Solder joint alloys - expected relative reliability
- PCB pad cratering (vs. pad lifting) ? causes and solutions;
- Open or insufficient solder Joints ? different sources, best practices;
- BGA head-on-pillow defect ? causes, factors, remedies;
- Copper dissolution - process factors, impact on through-hole joint reliability, mitigation;
- Lead-free through-hole barrel filling ? material, process and solder joint integrity;
- Defects of BTC and PoP solder joints - prevention and remedies;
- Intermetallic compounds ? fundamentals, characteristics;
- Intermetallic compounds ? effects on failure mode and reliability;
- Tin whisker - practical criteria, testing challenges;
- Tin whisker - contributing factors, risk mitigation, practical remedies;
- Summary

Target Group
The tutorial provides working knowledge by addressing the most prevalent production defects and product issues that affect yield, cost and reliability of the assembly, suitable to all who are involved with or interested in SnPb and Pb-free manufacturing including designers, engineers, researchers, managers, quality, manufacturing and reliability professionals, as well as business decision makers; also designed for those who desire the broad-based information.

Speaker

Speaker detail

Dr. Jennie Hwang
Dr. Jennie Hwang
H-Technologies Group Inc., Bedford, USA
Dr. Hwang, a long-standing leader in SMT manufacturing & lead-free implementation, brings deep knowledge to this tutorial. She has provided solutions to many challenging problems, ranging from production yield to field failure diagnosis to reliability issues. Author of 500+ publications & several internationally-used textbooks; speaker at innumerable international events; received many honors and awards. She chairs the Board of the Assessment of U.S. Army Research Laboratory, and on the National Materials and Manufacturing Board, National Laboratory Assessment Board and the Board of Army Science and Technology. Education with four academic degrees (Ph.D. M.S., M.A., B.S.) in Engineering/Science/Chemistry. Held senior executive positions with Lockheed Martin Corp. & other companies; an invited distinguished adj. professor of Engineering.


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