05. - 07.06.2018
Nuremberg
SMT Hybrid Packaging 2018
System Integration in Micro Electronics

 
 
 

Proceedings SMT Hybrid Packaging

Please note, that all papers, except those of ECWC13, are in German.

Table of Content Proceedings ECWC13 2014
Table of Content Proceedings 2012
Table of Content Proceedings 2011
Table of Content Proceedings 2010
Table of Content Proceedings 2009

Older editions can be ordered on demand. Ms Svenja Speidel will be happy to assist you at phone +49 711 61946-974.

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Item

Title Unit price net (EUR) Amount Total units
net (EUR)
Tagungsband ECWC13
ISBN 978-3-8007-3606-5
150,84
Tagungsband SMT Hybrid Packaging 2012
Systemintegration in der Mikroelektronik
ISBN 978-3-8007-3430-6
55,14
Tagungsband SMT/HYBRID/PACKAGING 2011
Systemintegration in der Mikroelektronik
- Zuverlässigkeit multifunktionaler Elektronikbaugruppen –
Moderne Analysemethoden und Teststrategien
(150 pages incl. CD ROM, papers in German)
ISBN 978-3-18-990094-1
55,14
Tagungsband SMT Hybrid Packaging 2010
Embedding-Technologien und ihre Wertschöpfungskette bei elektronischen Baugruppen
(160 pages incl. CD ROM, papers in German)
ISBN 978-3-8007-3226-5
23,36
Tagungsband SMT Hybrid Packaging 2009
Fertigung von elektronischen Baugruppen auf flex und starr-flex Basis
(160 pages incl. CD ROM, papers in German)
ISBN-Nr. 978-3-8007-3156-5
23,36
Total net (EUR)
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