Shape the Future of Microelectronics
The conference as well as the tutorials of SMT Hybrid Packaging cover current topics and address an audience of experts and interested professionals from Germany and abroad. International trends will be discussed, high-quality solutions will be presented and practice-oriented use cases along the complete value chain of electronic assembly production will be shown for three days.
The sessions examine challenges of new interconnection technologies (such as high-temperature contacts), advanced packaging options (such as fan-out packaging) and extended manufacturing processes (such as embedding of assemblies) amongst others. Experiences about process stability and long-term reliability will be part of the tutorials, too.
Of course, there will be a constant reference to various application settings (such as autonomous systems, internet of things or high-frequency communication) and enhancements in manufacturing organization.
We expect an exciting exchange and are happy to welcome you in Nuremburg.
Prof. Dr. Klaus-Dieter Lang
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM