16. - 18.05.2017
System Integration in Micro Electronics
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Warmly welcome to SMT Hybrid Packaging 2017!
Europe's leading event on System Integration in Micro Electronics - the perfect information platform for you.
Be there when the whole industry comes together. Here you can see innovative products, future trends and a wide range of service offers. Moreover you can discuss solutions regarding the challenges you are faced to – from the idea to development and production of electronic assemblies.
Three reasons to visit the exhibition
- Use the advisory character of the SMT Hybrid Packaging and develop individual solutions with experts.
- Get an overview of current trends, developments and innovations.
- Create your personal further education program out of conference, workshops and tutorials.
Hall 5, 4 and 4A
Exhibition Centre Nuremberg
SMT Hybrid Packaging
Save the date in your calendar
Call for Tutorials open
Submit your abstract online
until 4 October 2016 and become speaker at SMT Hybrid Packaging 2017.