16. - 18.05.2017
Nuremberg
SMT Hybrid Packaging 2017
System Integration in Micro Electronics

 
 
 

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SMT Hybrid Packaging is the only event in Europe which takes a comprehensive view of System intergration in microelectronics, from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies.

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SMT Hybrid Packaging

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SMT Hybrid Packaging 2018
5 - 7 June 2018