05. - 07.06.2018
Nuremberg
SMT Hybrid Packaging 2018
System Integration in Micro Electronics

 
 
 

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1. Development services
1.1.
Circuit contract development
1.1.1.
ASIC design
1.1.2.
PCB assembly design/hardware design
1.1.3.
Software design
1.1.4.
Designs
1.1.5.
Circuit optimization
1.1.6.
Design of hybride circuits
1.2.
Functional test
1.2.1.
Electrical simulation service
1.2.2.
Thermal simulation service
1.2.3.
Thermo-mechanical simulation service
1.3.
Audits
1.3.1.
ESD Audit
2. Production preparation / preproduction
2.1.
Incomming goods inspection
2.1.1.
Light microscopes
2.1.2.
Magnifier lamps
2.2.
Marking and labeling equipment
2.2.1.
Labels
2.2.2.
Label printer
2.2.3.
Label application
2.2.4.
Laser marking
2.2.5.
Barcode solutions
2.2.6.
RFID solutions
2.3.
Component loading
2.3.1.
Component preparation equipment
2.3.2.
Inertia belt reel
2.3.3.
Heat sealing machines
2.3.4.
Magazining units
2.3.5.
Carrier/blister tapes
2.4.
Material disopositon
3. Computer aided design tools
3.1.
Design
3.1.1.
System design tools
3.1.2.
Layout systems
3.1.3.
Placing systems
3.1.4.
CAD/CAM software
3.1.5.
CAE/CAD tools
3.1.6.
Components library
3.2.
Simulation
3.2.1.
Electrical simulation tools
3.2.2.
Thermal simulation tools
3.2.3.
Thermo-mechanical simulation tools
3.2.4.
Logic simulators
3.2.5.
ASIC simulators
3.3.
Programming
3.3.1.
Programming tools
3.3.2.
In-Circuit programmers
3.4.
Test
3.4.1.
Test pattern generators
4. Technology development, consulting and training
4.1.
Research Institutes
4.1.1.
R & D of electronic material
4.1.2.
Technology R & D
4.1.2.1.
R & D for wafer level packaging
4.1.2.2.
R & D for chip interconnection technologies
4.1.2.3.
R & D for substrate technologies / embedding
4.1.2.4.
R & D for 3D circuit carrier
4.1.2.5.
R & D for optical interconnects
4.1.2.6.
R & D for encapsulation
4.1.3.
Reliability R & D
4.1.4.
R & D for system design
4.1.5.
R & D for production engineering
4.2.
Consulting and Training
4.3.
Trend analysis
4.4.
Publishers
5. Components and modules
5.1.
Logic components
5.2.
Mixed signal components
5.3.
Power components
5.4.
Passive components
5.4.1.
Capacitors
5.4.2.
Coils
5.4.3.
Resistors
5.4.4.
Quartz oscillators
5.4.5.
Fuses/Fuseholders
5.4.6.
Resonators
5.5.
Switches and relays
5.5.1.
Relays
5.5.2.
Switches
5.5.3.
Code switches
5.5.4.
Other switches
5.6.
Film circuits
5.6.1.
Thickfilm devices
5.6.2.
Thinfilm devices
5.6.3.
Hybrid modules
5.7.
Interconnection devices
5.7.1.
Plugs
5.7.2.
Sockets
5.7.3.
Connectors
5.7.4.
Contact elements
5.7.5.
Coupler
5.8.
Cable
5.9.
Cable assembly
5.9.1.
Insulation stripping tools and machines
5.9.2.
Crimping machines
5.9.3.
Cable assembly machines
5.9.4.
Cable harness sheating machines
5.9.5.
Cable marking systems
5.10.
Cable hardness assembly
5.10.1.
Cable confection service
5.10.2.
Cable hardness sheating service
5.10.3.
Cable marking systems
5.10.4.
Crimp services
5.11.
Line sets
5.12.
LED and Displays
5.12.1.
Display systems
5.12.2.
LC Displays and modules
5.12.3.
Plasma displays
5.12.4.
Touch screen systems
5.12.5.
Other displays
5.13.
Batteries and holders
5.13.1.
Batteries
5.13.2.
Battery holders
5.14.
Key boards and input devices
5.15.
Dummy components
5.16.
Housing
5.16.1.
Enclosures for electronics
5.16.2.
Sensor packages
5.16.3.
Housing for microsystems
5.16.4.
Thermal management packages
5.16.5.
Hybrid housing
5.16.6.
Ceramic packagings
5.16.7.
Metal top cover
5.16.8.
Ball grid arrays
5.16.9.
PAL, PLD, FPGA
5.16.10.
Pin-Grid arrays
5.17.
MID
5.18.
Interposer
5.19.
Smart Cards
6. Materials and Components for Thermal Management
6.1.
Thermal interface materials
6.2.
Cooler
6.3.
Fan / Ventilator
6.4.
Other components
7. Circuit carriers and processing equipment
7.1.
Circuit carriers and substrate materials
7.1.1.
Ceramic circuit carriers
7.1.1.1.
Ceramic substrates and circuits
7.1.1.2.
LTCC tape materials and circuits
7.1.1.3.
Direct bonded copper substrates
7.1.2.
FR4 circuit carriers
7.1.2.1.
Resins
7.1.2.2.
Laminates
7.1.2.3.
Single and multilayer substrates
7.1.2.4.
PCB with embedded components
7.1.2.5.
Thick copper PCB
7.1.2.6.
Heatsink PCB
7.1.3.
Flexible circuit carriers
7.1.4.
3 dimensional circuit carriers
7.1.4.1.
3D MID
7.1.5.
Circuit carrier for special purposes
7.1.5.1.
High temperature circuit carriers
7.1.5.2.
High frequency circuit carriers
7.1.5.3.
High current circuit carriers
7.1.5.4.
High density interconnect circuit carriers
7.1.5.5.
Optical/electro-optical circuit carrier
7.1.6.
Other substrates
7.1.6.1.
Alumnium circuit carriers
7.1.6.2.
IMS substrates
7.1.6.3.
Copper laminated metal substrates
7.1.6.4.
Photo-sensitive substrates
7.2.
LTCC/HTCC processing equipment
7.2.1.
Laser trimming
7.3.
Polymer electronic
7.4.
Mechanical processing of circuit carriers
7.4.1.
Drilling and routing
7.4.1.1.
Drilling and routing machines
7.4.1.2.
Drills, routers
7.4.2.
Depaneling machines (see also 3 manufacturing equipment for components and modules)
7.4.2.1.
Scribing machines
7.4.2.2.
Saws
7.4.2.3.
Punching system and equipment
7.4.2.4.
Plate shears
7.4.2.5.
Laser depaneling machines
7.4.3.
Brushing machines
7.4.4.
Multilayer presses
7.4.5.
Laminators/rolling mills
7.5.
Stucturing
7.5.1.
Coating equipment
7.5.2.
Plating equipment
7.5.3.
Exposure and plotting
7.5.3.1.
Photo plotters
7.5.3.2.
Circuit board plotter
7.5.3.3.
Development equipment
7.5.3.4.
Stripping machines
7.5.3.5.
Laser structuring
7.6.
Metallization
7.7.
Molding
7.7.1.
Mold presses
7.7.2.
Molding tools
7.7.3.
Cutting/punching presses
7.7.4.
Cutting/punching tools
7.7.5.
Moulding compounds
7.7.6.
Leadframes
7.8.
Lasers
8. Material testing
8.1.
Hardness measurement devices
8.2.
Viscosimeter
8.3.
Microscope
8.4.
Humidity
8.5.
Wetting
8.6.
Electrical resistance
9. Manufacturing equipment for components and modules
9.1.
Printing
9.1.1.
Template and screen print
9.1.1.1.
Template and screen printers
9.1.1.2.
Templates and screens
9.1.1.3.
Sweegees
9.1.1.4.
Screen and template print equipment
9.1.1.5.
Screen and soldering frame cleaner
9.1.1.6.
Self-mounting systems
9.1.1.7.
Thick film inks
9.1.1.8.
Soldering pastes
9.1.1.9.
Adhesives
9.1.2.
Dispensing and mixing
9.1.2.1.
Dispensing machines
9.1.2.2.
Dispensing accessories
9.1.3.
Encapsulants
9.1.3.1.
Globtop materials
9.1.3.2.
Potting materials
9.1.3.3.
Underfiller
9.1.4.
Conformal coating
9.1.4.1.
Conformal coating systems
9.1.4.2.
Conformal coatings
9.1.5.
Jetting
9.1.5.1.
Ink jetter
9.1.5.2.
Paste jetter
9.1.5.3.
Solderpaste jetter
9.2.
Adhesive bonding
9.2.1.
Adhesives
9.2.2.
SMD adhesives
9.2.3.
Conductive adhesives
9.2.4.
Die attach adhesives
9.3.
Placement machines and assembly stations
9.3.1.
Manual/semiautomatic SMT-insertion machines
9.3.2.
Fully automatic SMT-insertion machines
9.3.3.
3D assembly equipment
9.3.4.
Positioning systems
9.3.5.
Special assembly stations
9.3.6.
Assembly tools and benches
9.4.
Soldering
9.4.1.
Reflow soldering systems
9.4.2.
Vapor phase soldering systems
9.4.3.
Wave soldering systems
9.4.4.
IR soldering systems
9.4.5.
Laser soldering systems
9.4.6.
Selective soldering systems
9.4.7.
Special soldering systems
9.4.7.1.
Pulse type soldering systems
9.4.7.2.
Induction soldering systems
9.4.7.3.
Plasma soldering systems
9.4.7.4.
Spot soldering systems
9.4.8.
Soldering irons
9.4.8.1.
Hot bar soldering systems
9.4.8.2.
Light beam soldering systems
9.4.8.3.
Nitrogen handsoldering stations
9.4.8.4.
Hand wave soldering systems
9.4.8.5.
Hot air soldering systems
9.4.9.
Soldering materials
9.4.9.1.
Solders
9.4.9.2.
Soldering paste
9.4.9.3.
Preforms
9.4.9.4.
Solder wires
9.4.9.5.
Solder spheres
9.4.10.
Fluxes
9.4.11.
Soldering auxiliary equipment
9.4.11.1.
Soldering masks
9.4.11.2.
Soldering frames
9.4.11.3.
Soldering aids
9.4.11.4.
Solder tip cleaning equipment
9.4.11.5.
Solder wire feeder
9.4.12.
Solder recovery
9.4.13.
Solder analysis
9.5.
Welding equipment
9.6.
Hardening
9.6.1.
UV-Hardening
9.6.2.
IR-Hardening
9.6.3.
Thermal hardening
9.6.4.
Vacuum ovens
9.6.5.
Hotplates
9.7.
Bonding
9.7.1.
Diebonder
9.7.2.
Wire bonder
9.7.2.1.
Wire bonding machines
9.7.2.2.
Wire bonding tools
9.7.2.3.
Bond wires
9.7.2.4.
Ultrasonic generators
9.7.2.5.
Ultrasonic transducer systems
9.8.
Press-fit insertion technology
9.9.
Mechanical connection technology
9.9.1.
Clamping
9.9.2.
Plugging
9.9.3.
Crimping
9.10.
Manual workstations
9.10.1.
BGA/SMT reworksystems
9.10.2.
PCB track control and repair stations
9.11.
Balling
9.11.1.
Manual / semiautomatic balling systems
9.11.2.
Fully automatic balling systems
9.12.
Depaneling machines
10. Manufacturing supporting equipment
10.1.
Automation and handling equipment
10.1.1.
Component loading equipment
10.1.2.
Handling systems for chips
10.1.3.
Handling equipment and automatic feed
10.1.4.
Machine linking and transport
10.1.5.
Storage devices
10.1.6.
Drives
10.1.6.1.
Direct drives
10.1.6.2.
Linear motors
10.1.6.3.
Linear actuators
10.2.
Cleanroom technologies
10.2.1.
Cleanroom equipment
10.2.2.
Cleanroom materials
10.2.3.
Flow boxes
10.3.
Workplace furniture
10.3.1.
Assembly benches
10.3.2.
Magnifier
10.3.3.
Lamps
10.4.
ESD-Protection
10.4.1.
Anti-static work places
10.4.2.
ESD - clothing
10.4.3.
ESD - packaging, storage, shipping
10.4.4.
ESD - other products
10.5.
Storage
10.5.1.
Dry storage systems
10.5.2.
Storage systems under nitrogen atmosphere
10.5.3.
Vacuum storage sytems
10.5.4.
Cooling cabinets
10.5.5.
Heating cabinets
10.6.
Magazines and containers
10.6.1.
Plastic magazines and containers
10.6.2.
Metal magazines and containers
10.6.3.
Vacuum boxes
10.7.
Packaging
10.7.1.
Carrier/blister tapes
10.7.2.
Packaging material
10.7.3.
Desiccants
10.7.4.
Humidity indicator cards
10.8.
Cleaners
10.8.1.
Stencil cleaners
10.8.2.
PCB cleaners
10.8.3.
Plastic cleaners
10.9.
Cleaning and recycling systems
10.9.1.
Plasma cleaning systems
10.9.2.
Dry ice jet cleaner
10.9.3.
Other cleaning devices
10.9.4.
Waste water recycling equipment
10.9.5.
Nobel metal recycling euipment
10.9.6.
Filtration apparatus
10.9.7.
Ionization devices
10.10.
Environment and occupational safety
10.10.1.
Solder recovery
10.10.2.
Exhaust systems
10.10.3.
Solder vapour extraction systems
10.10.4.
Filters
10.10.5.
Solder fume exhaust systems
10.10.6.
Gas purification and flux condensing units
10.10.7.
Fan/ventilator
10.11.
Product documentation
11. Manufacturing services
11.1.
Electronic Manufacturing Services (EMS)
11.1.1.
Assembly
11.1.1.1.
SMD assembly
11.1.2.
Surface pretreatment
11.1.3.
Plating of substrates
11.2.
PCB Manufacturing
11.2.1.
Photo plotter service
11.3.
Components provision
11.3.1.
Taping and reeling
11.3.2.
SMD Taping
11.3.3.
Cutting, bending, forming
11.3.4.
Sorting
11.4.
Wafer level packaging
11.4.1.
Wafer thinning
11.4.2.
Wafer level redistribution
11.4.3.
Wafer bumping
11.4.4.
Chip size packaging (CSP)
11.4.5.
Semiconductor interconnections
11.4.6.
Semiconductor housing
11.5.
Panel Level Packaging
11.6.
Chip on Board - Assembly
11.6.1.
Chip on Flex assembly
11.6.2.
Flip Chip assembly
11.6.3.
Chip on Glas assembly
11.7.
Film circuits
11.7.1.
Thick film hybrids
11.7.2.
Thin film circuits
11.8.
Laser machining
11.8.1.
Laser drilling
11.8.2.
Laser cutting
11.8.3.
Laser trimming
11.9.
Encapsulation
11.9.1.
Molding
11.9.2.
Potting
11.9.3.
Glob top
11.9.4.
Dam & Fill
11.9.5.
Hermetic packaging
11.10.
Cleaning
11.11.
Assembly inspection and testing
11.11.1.
Testhouses
11.11.2.
AOI Service
11.11.3.
AXI Service
11.11.4.
Test program development
11.12.
Sample and smallsize productions
11.13.
Quality assurance and analysis
11.13.1.
Release testing
11.13.2.
Reliability consulting
11.13.3.
Failure analysis
11.13.4.
Calibration services
11.14.
Repair
12. Used SMT-Equipment13. Test equipment for assemblies
13.1.
Optical inspection stations
13.1.1.
Automatic optical inspection (AOI)
13.1.1.1.
Solder paste AOI
13.1.1.2.
Assembly AOI
13.1.2.
Manual optical inspection
13.1.2.1.
Magnifier lamps
13.1.2.2.
Microscopes
13.1.3.
PCB inspection systems
13.1.4.
Surface measuring system
13.1.4.1.
Laser profilometer
13.1.4.2.
Roughness measurement systems
13.1.4.3.
Flatness measurement systems
13.1.5.
Film thickness measuring device
13.2.
Electrical inspection
13.2.1.
Component test equipment
13.2.2.
Probe card analyzer, probes, probe cards
13.2.3.
PCB test equipment
13.2.4.
Assembly test equipment
13.2.5.
In-circuit test equipment and programs
13.2.6.
Flying probe test equipment
13.2.7.
Function test equipment
13.2.8.
Insulation test equipment
13.2.9.
EMC test equipment
13.2.10.
High frequency measurement equipment
13.2.11.
Hot test for PCB and hybrids
13.2.12.
Test programs
13.2.13.
Other test and balance systems
13.3.
X-ray inspection
13.3.1.
Computer tomography
13.3.2.
Automatic X-ray inspection
13.3.3.
Manual X-ray inspection
13.4.
Ultrasonic sound inspection
13.4.1.
Transducter test systems
13.4.2.
Acustic microscopes
13.5.
Mechanical inspection
13.5.1.
Bonding testers
13.5.2.
Adhesion testers
13.6.
Chemical inspection
13.6.1.
Contaminometers
13.6.2.
Hygrometer
13.6.3.
Oxygen analyzers
13.6.4.
Other analytical / diagnostical equipment
13.7.
Other inspection systems
13.7.1.
Sonar test equipment
13.7.2.
Leakage testers
13.8.
Burn-in systems
13.9.
Cycle test
13.10.
Equipment accessories for assembly inspection
13.10.1.
Test pins
13.10.2.
Grinding machines
14. Process and equipment testing
14.1.
Process and equipment systems
14.1.1.
Optical displacement measurement systems
14.1.2.
Optical amplitude measurement systems for wirebonder
14.1.3.
Bondability tester
14.1.4.
Adhesion testers
14.1.5.
Screen tension measuring devices
14.1.6.
Solderability testers
14.1.7.
Soldering machines control equipment
14.1.8.
Temperature profiler
14.1.9.
Training and testkids
14.2.
MES-System
14.2.1.
Production data acquisition systems
14.2.2.
Machine data acquisition systems
14.3.
Process and quality data mangement
14.4.
Traceability systems
14.5.
Software
14.6.
RF-Transponders