05. - 07.06.2018
Nuremberg
SMT Hybrid Packaging 2018
System Integration in Micro Electronics

 
 
 

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1. Development services
1.1.1.
1.1.4.
1.3.
1.3.1.
2. Production preparation / preproduction
2.2.1.
2.2.2.
2.2.4.
3. Computer aided design tools
3.1.
Design
3.1.1.
System design tools
3.1.2.
Layout systems
3.1.3.
Placing systems
3.1.5.
CAE/CAD tools
3.2.
3.2.1.
Electrical simulation tools
3.2.2.
Thermal simulation tools
3.2.3.
Thermo-mechanical simulation tools
3.2.4.
Logic simulators
3.2.5.
ASIC simulators
3.4.
3.4.1.
Test pattern generators
4. Technology development, consulting and training
4.3.
Trend analysis
4.4.
5. Components and modules
5.2.
Mixed signal components
5.4.1.
Capacitors
5.4.2.
Coils
5.4.3.
Resistors
5.4.4.
Quartz oscillators
5.4.5.
Fuses/Fuseholders
5.4.6.
Resonators
5.5.
Switches and relays
5.5.1.
Relays
5.5.2.
Switches
5.5.3.
Code switches
5.5.4.
Other switches
5.6.2.
Thinfilm devices
5.7.1.
5.7.2.
5.7.3.
5.7.4.
Contact elements
5.7.5.
Coupler
5.8.
Cable
5.9.1.
Insulation stripping tools and machines
5.9.2.
Crimping machines
5.9.3.
Cable assembly machines
5.9.4.
Cable harness sheating machines
5.10.
Cable hardness assembly
5.10.2.
Cable hardness sheating service
5.10.4.
Crimp services
5.11.
Line sets
5.12.1.
Display systems
5.12.2.
LC Displays and modules
5.12.3.
Plasma displays
5.12.5.
Other displays
5.13.
Batteries and holders
5.13.1.
5.13.2.
5.16.
5.16.2.
5.16.4.
Thermal management packages
5.16.5.
Hybrid housing
5.16.6.
Ceramic packagings
5.16.7.
Metal top cover
5.16.8.
Ball grid arrays
5.16.9.
5.16.10.
5.17.
MID
5.18.
5.19.
6. Materials and Components for Thermal Management
6.2.
Cooler
6.3.
Fan / Ventilator
7. Circuit carriers and processing equipment
7.1.2.1.
7.1.2.2.
Laminates
7.1.2.5.
7.1.2.6.
7.1.4.1.
3D MID
7.1.5.5.
Optical/electro-optical circuit carrier
7.1.6.2.
IMS substrates
7.1.6.3.
Copper laminated metal substrates
7.1.6.4.
Photo-sensitive substrates
7.4.1.2.
Drills, routers
7.4.2.1.
Scribing machines
7.4.2.2.
7.4.2.4.
Plate shears
7.4.3.
Brushing machines
7.4.4.
Multilayer presses
7.4.5.
Laminators/rolling mills
7.5.
7.5.2.
Plating equipment
7.5.3.
Exposure and plotting
7.5.3.1.
Photo plotters
7.5.3.3.
Development equipment
7.7.
7.7.1.
7.7.2.
7.7.6.
7.8.
8. Material testing
8.2.
Viscosimeter
8.3.
8.4.
8.5.
9. Manufacturing equipment for components and modules
9.1.
9.1.1.3.
9.1.1.7.
9.1.1.8.
9.1.1.9.
9.1.3.
9.1.3.3.
9.1.5.
9.1.5.1.
9.1.5.2.
9.2.1.
9.2.2.
9.4.
9.4.8.3.
Nitrogen handsoldering stations
9.4.8.4.
Hand wave soldering systems
9.4.9.1.
9.4.9.2.
9.4.9.3.
9.4.9.4.
9.4.9.5.
9.4.10.
9.4.11.1.
9.4.11.2.
9.4.11.3.
9.4.11.5.
9.4.12.
9.4.13.
9.6.
9.6.1.
9.6.2.
9.6.4.
9.6.5.
9.7.
9.7.1.
9.7.2.
9.7.2.3.
9.9.
Mechanical connection technology
9.9.1.
9.9.2.
9.9.3.
Crimping
9.11.
10. Manufacturing supporting equipment
10.1.5.
10.1.6.
Drives
10.1.6.1.
Direct drives
10.1.6.2.
Linear motors
10.1.6.3.
Linear actuators
10.2.3.
10.3.2.
10.3.3.
10.4.2.
10.5.
10.5.4.
Cooling cabinets
10.6.3.
Vacuum boxes
10.7.
10.7.3.
10.8.
10.8.2.
10.9.2.
Dry ice jet cleaner
10.9.6.
Filtration apparatus
10.9.7.
Ionization devices
10.10.1.
10.10.2.
10.10.4.
10.10.7.
10.11.
Product documentation
11. Manufacturing services
11.1.1.
11.1.1.1.
11.2.1.
Photo plotter service
11.3.2.
SMD Taping
11.3.4.
11.4.1.
11.4.3.
11.4.5.
Semiconductor interconnections
11.4.6.
Semiconductor housing
11.7.2.
Thin film circuits
11.8.1.
11.8.2.
11.8.3.
11.9.1.
11.9.2.
11.9.3.
11.9.4.
11.10.
11.11.1.
11.11.2.
11.11.3.
11.11.4.
Test program development
11.13.1.
Release testing
11.13.3.
11.14.
12. Used SMT-Equipment13. Test equipment for assemblies
13.1.1.1.
13.1.1.2.
13.1.2.1.
13.1.2.2.
13.1.4.1.
Laser profilometer
13.2.8.
Insulation test equipment
13.2.9.
EMC test equipment
13.2.12.
13.5.1.
13.6.1.
13.6.2.
13.6.3.
Oxygen analyzers
13.6.4.
Other analytical / diagnostical equipment
13.7.1.
Sonar test equipment
13.7.2.
Leakage testers
13.9.
Cycle test
13.10.1.
13.10.2.
Grinding machines
14. Process and equipment testing
14.1.1.
Optical displacement measurement systems
14.2.
14.5.
14.6.
RF-Transponders