16. - 18.05.2017
SMT Hybrid Packaging 2017
System Integration in Micro Electronics


New at SMT Hybrid Packaging

Besides popular and established highlights, this year’s SMT Hybrid Packaging offers several novelties. What to expect among other things:


First-time exhibitors

For the first time new exhibitors present their products and services at the joint stand Newcomer Pavilion (hall 4, booth 431). In addition you can meet more than 35 other exhibitors who haven’t been represented at SMT Hybrid Packaging yet.


Cluster ‘Mechatronik & Automation’

Increment in joint stands: The Cluster ‘Mechatronik & Automation’ (hall 4, booth 514) provides a communication platform for electronics development and manufacturing.


Short tutorials

Alongside the proven tutorials and half day sessions you can choose among several short tutorials of 90 minutes duration to arrange your personal program.



From April on you will find all information about the exhibition and conference in the mobile app too. More coming soon.