05. - 07.06.2018
SMT Hybrid Packaging 2018
System Integration in Micro Electronics


Hand Soldering Competition

IPC and SMT Hybrid Packaging 2018 have teamed up to bring something new to the Hand Soldering Competition.

IPC will once again hold the IPC Hand Soldering Competition regional qualification in conjunction with SMT Hybrid Packaging 2018. This competition will bring out the best competitors in Europe for the opportunity to win the first-place cash award of €300. The winner will be invited by IPC USA to participate in the IPC HSC 2019 World Championship, which takes place at the IPC APEX EXPO 2019, in San Diego, California USA. The winner at SMT Hybrid Packaging 2018 will not only win a trip to San Diego but will have the opportunity to compete for the first-place prize of $1,000 at the World HSC Championship. At the IPC HSC World Championship 2017, which took place November 17 in Munich Germany, the winner once again was from Asia so there will be excitement in 2019 to see if a European winner can bring the championship back to Europe.

The exciting news for STM Hybrid Packaging 2018 is the introduction of an IPC Hand Soldering Competition for beginners. This competition will follow the same guidelines used for the professionals but will include a PCBA that will meet the beginners level and skill. Cash prizes will be awarded the first with 50 €, second with 30 € and third place with 20 €.

Come join the IPC HSC competition at SMT Hybrid Packaging 2018, hall 4, booth 4-400. For more information and interest please click on the link to get access to the invitation and registration flyer for either the professional or the beginner IPC HSC event, alternative contact the IPC European Representative Lars Wallin at LarsWallin@ipc.org or +46 70 212 74 39.

Winners of the Hand Soldering Competition 2017

  1. Elaine Chesnais, Thales International
  2. Aurelie Buret, Thales International
  3. Ekatherina Stahlmann, Grundig Business Systems

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