05. - 07.06.2018
SMT Hybrid Packaging 2018
System Integration in Micro Electronics


Production Line "Future Packaging"

“SMART MOTION”: Intelligent Automation for E-Mobility and Robotics

Much sooner than thought possible only a few years ago, electric vehicles, robotics, and driverless cars have won themselves an immensely important role in real-life, everyday use. Many systems in the field have passed the all-important threshold to mass production. The highly innovative enterprises behind them now need to face the special challenges and complexities of industrial-scale manufacturing. Not every disruptive change guarantees more effective outcomes. Successful results can only be achieved in all of these areas with the right sensor and actuator technology. Manufacturers and mechanical engineers need to join forces and implement new ways of working together that enable continuous improvement and innovation.

The team behind the Future Packaging production line has several potential solutions in store for all of these issues that it wants to share with and, more importantly, demonstrate live to the visitors of SMT 2018.

This year’s production line exhibit revolves around creating an IoT toolkit to make the many possible use cases of the Internet of Things more tangible for the show’s visitors. The Fraunhofer’s Berlin Center for Digital Transformation figures prominently at the shared Future Packaging booth as the first port of call for interdisciplinary project and product development in the area. Particular attention is given to the field of cyber-physical systems with their promise to combine applied research and marketable applications to power the many possible uses of the Internet of Things and Industrie 4.0.

Live production with guided tour

The IoT toolkit will be assembled three times each day on the production line in hall 5, booth 5-434:

Tuesday, 5 June 2018
 10:00 hrs
13:00 hrs (EN)
 15:00 hrs
Wednesday, 6 June 2018
 10:00 hrs
13:00 hrs
 15:00 hrs (EN)
Thursday, 7 June 2018
 10:00 hrs (EN)
13:00 hrs
 15:00 hrs


For more information about the “Future Packaging” production line joint booth, contact: Messe SMT Hybrid Packaging Fertigungslinie Future Packaging

Dipl.-Ing. Ulf Oestermann
Fraunhofer IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone: +49 30 46403-235
Fax: +49 30 46403-161
E-mail: ulf.oestermann[at]izm.fraunhofer.de
or on the web at www.future-packaging.de