05. - 07.06.2018
Nuremberg
SMT Hybrid Packaging 2018
System Integration in Micro Electronics

 
 
 

Exhibition Forum

SMT Hybrid Packaging 2018 offers you a diverse, professional supporting program with panel discussions and vendor presentations

The forum is one of the highlights where you get a perfect overview on recent trends and product developments.

  

Schedule

05 - 07 June 2018

 

Free Admission

For visitors, exhibitors and conference delegates.

  

Premises

Exhibition Forum, hall 4, booth 4-520
ZVEI Forum, hall 4A, booth 4A-400