16. - 18.05.2017
Nuremberg
SMT Hybrid Packaging 2017
System Integration in Micro Electronics

 
 
 

Exhibition Forum

SMT Hybrid Packaging 2017 offers you a diverse, professional supporting program with panel discussions and vendor presentations

The forum is one of the highlights where you get a perfect overview on recent trends and product developments.

  

Schedule

16 - 18 May 2017

 

Free Admission

For visitors, exhibitors and conference delegates.

  

Premises

Exhibition Forum, hall 5, booth 5-306
EMS / PCB Forum, hall 5, booth 5-221A