05. - 07.06.2018
Nuremberg
SMT Hybrid Packaging 2018
System Integration in Micro Electronics

 
 
 

Exhibition Forum

SMT Hybrid Packaging 2018 offers you a diverse, professional supporting program with panel discussions and vendor presentations

The forum is one of the highlights where you get a perfect overview on recent trends and product developments.

  

Schedule

5 - 7 June 2018

 

Free Admission

For visitors, exhibitors and conference delegates.

  

Premises

The placement will be published in April 2018.

 

Forum program

The program of 2018 will be published in April 2018.

 

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