05. - 07.06.2018
SMT Hybrid Packaging 2018
System Integration in Micro Electronics


Exhibition Forum

SMT Hybrid Packaging 2018 offers you a diverse, professional supporting program with panel discussions and vendor presentations

The forum is one of the highlights where you get a perfect overview on recent trends and product developments.



5 - 7 June 2018


Free Admission

For visitors, exhibitors and conference delegates.



The placement will be published in April 2018.


Forum program

The program of 2018 will be published in April 2018.


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