05. - 07.06.2018
Nuremberg
SMT Hybrid Packaging 2018
System Integration in Micro Electronics

 
 
 

Experience the diversity of assembly and interconnection technologies

The exhibition and conference shows the complete spectrum on system integration in micro electronics. This international meeting point in the field of electronic manufacturing offers the latest products, services and solutions - the complete market overview under one roof.

Key topics:

  • Technologies and Processes
  • Materials and Components
  • Manufacturing
  • Manufacturing equipment
  • Reliability and Test
  • Software and Systems
  • Service and Consulting

SMT Hybrid Packaging