05. - 07.06.2018
Nuremberg
SMT Hybrid Packaging 2018
System Integration in Micro Electronics

 
 
 

press releases

1. Total view of systems integration in microelectronics
13.03.2018, English

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2. Conference and tutorial registration now open
01.03.2018, English

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3. Many exhibitors already registered
14.12.2017, English

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4. Update: SMT Hybrid Packaging 2018
26.10.2017, English

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5. Analysis SMT Hybrid Packaging 2017: Impressive satisfaction of exhibitors and visitors
25.07.2017, English

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Facts, figures and presentations

1. Analysis SMT Hybrid Packaging 2017
25.07.2017, English

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