16. - 18.05.2017
System Integration in Micro Electronics
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Warmly welcome to SMT Hybrid Packaging 2017!
16 - 18 May 2017
Your leading event on System Integration in Micro Electronics in Europe.
Present the latest trends and developments as well as up-to-date solutions to numerous trade visitors. With 36% of foreign exhibitors, the event offers not only a wide, but also an international spectrum.
Hall 5, 4 and 4A
Exhibition Centre Nuremberg
SMT Hybrid Packaging
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Novelty at SMT Hybrid Packaging: Newcomer Pavilion
At SMT Hybrid Packaging 2017 a special offer will be available: the Newcomer Pavilion.
Here first-time exhibitors have the possibility of a cost-conscious participation.
SMT Hybrid Packaging 2016: Analysis
of SMT Hybrid Packaging 2016 is available now. Get a detailed overview of the exhibition.