16. - 18.05.2017
System Integration in Micro Electronics
One moment please, your data is being retrieved.
Warmly welcome to SMT Hybrid Packaging 2017!
16 - 18 May 2017
Your leading event on System Integration in Micro Electronics in Europe.
Present the latest trends and developments as well as up-to-date solutions to numerous trade visitors. With 36% of foreign exhibitors, the event offers not only a wide, but also an international spectrum.
Why exhibiting? This is the industry’s opinion.
Is it worth to join the SMT Hybrid Packaging 2017? Many exhibitors are convinced already: “TOWA Europe B.V. PDC has been present at SMT Hybrid Packaging for the past 6 years and it has been very much worthwhile, because it has been an excellent opportunity to meet with customers, to make new contacts and obtain new leads.” (Pete Molenaar, Marketing Manager of TOWA Europe B.V. PDC).
Read more statements
Hall 5, 4 and 4A
Exhibition Centre Nuremberg
SMT Hybrid Packaging
Save the date in your calendar
Novelty at SMT Hybrid Packaging: Newcomer Pavilion
At SMT Hybrid Packaging 2017 a special offer will be available: the Newcomer Pavilion.
Here first-time exhibitors have the possibility of a cost-conscious participation.