05. - 07.06.2018
SMT Hybrid Packaging 2018
System Integration in Micro Electronics


Call for Tutorials is running



Speakers have the opportunity to submit their abstract for the (short) tutorials of SMT Hybrid Packaging until 2 November 2017.

The tutorials cover current topics and address an audience of experts and interested professionals from Germany and abroad. International trends will be discussed, high-quality solutions will be presented and practice-oriented user cases along the complete value chain of electronic assembly production will be shown.

The tutorials are designed to give deep solution-oriented knowledge about specific topics related to system integration in microelectronics. They are to include practical experiences, case studies, hands-on activities and/or demonstrations (as far as the subject allows).

Besides free access to the exhibition and the party, speakers can expect numerous benefits and join a group of prestigious lecturers from the past.