05. - 07.06.2018
Nuremberg
SMT Hybrid Packaging 2018
System Integration in Micro Electronics

 
 
 

Call for Tutorials is running

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Speakers have the opportunity to submit their abstract for the (short) tutorials of SMT Hybrid Packaging until 2 November 2017.

The tutorials cover current topics and address an audience of experts and interested professionals from Germany and abroad. International trends will be discussed, high-quality solutions will be presented and practice-oriented user cases along the complete value chain of electronic assembly production will be shown.

The tutorials are designed to give deep solution-oriented knowledge about specific topics related to system integration in microelectronics. They are to include practical experiences, case studies, hands-on activities and/or demonstrations (as far as the subject allows).

Besides free access to the exhibition and the party, speakers can expect numerous benefits and join a group of prestigious lecturers from the past.