Call for Tutorials is running
Speakers have the opportunity to submit their abstract for the (short) tutorials of SMT Hybrid Packaging until 2 November 2017.
The tutorials cover current topics and address an audience of experts and interested professionals from Germany and abroad. International trends will be discussed, high-quality solutions will be presented and practice-oriented user cases along the complete value chain of electronic assembly production will be shown.
The tutorials are designed to give deep solution-oriented knowledge about specific topics related to system integration in microelectronics. They are to include practical experiences, case studies, hands-on activities and/or demonstrations (as far as the subject allows).