SMT Hybrid Packaging 2017 stays leading platform of electronic manufacturing
Furthermore the special interest platform “High Tech PCB Area” as well as the joint stands “EMS-Intersection”, “Optics meets Electronics” and Cluster Mechatronic and Automation were visitor attractions where local concentrated exhibitors presented their products, services and technologies.
On the forums many professional panel discussions as well as product presentations were held.
In addition participants of the conference could enlarge their knowledge including half-day and short-tutorials and establish new contacts with speakers and other participants.
The SMT Hybrid Packaging 2018 will take place from 5 – 7 June 2018.