05. - 07.06.2018
Nuremberg
SMT Hybrid Packaging 2018
System Integration in Micro Electronics

 
 
 

SMT Hybrid Packaging 2017 stays leading platform of electronic manufacturing

Three successful exhibition- and conference days ended on 18 May 2017. Approximately 15,000 visitors came to Nuremberg and compared notes with 420 exhibitors on the latest trends, innovations and market developments. Individual challenges and solutions were discussed.

Highlights of the event amongst others were the production line “Future Packaging” where the complete process of producing PCBs was demonstrated and the hand soldering competition.

Furthermore the special interest platform “High Tech PCB Area” as well as the joint stands “EMS-Intersection”, “Optics meets Electronics” and Cluster Mechatronic and Automation were visitor attractions where local concentrated exhibitors presented their products, services and technologies.

On the forums many professional panel discussions as well as product presentations were held.

In addition participants of the conference could enlarge their knowledge including half-day and short-tutorials and establish new contacts with speakers and other participants.

The SMT Hybrid Packaging 2018 will take place from 5 – 7 June 2018.