05. - 07.06.2018
PCIM Europe 2018
Power Electronics | Intelligent Motion | Renewable Energy | Energy Management


Oral Session

Advanced Packaging Technologies I


Tuesday, 05.06.2018, 14:00 - 15:15 hrs


Brüssel 2


Masahito Otsuki, Fuji Electric, J


14:00 Investigation of Ton Dependency of Al-Clad Cu Bond Wires Under Power Cycling Tests
M.Sc. Nan Jiang, Technical University of Chemnitz, Chemnitz, Deutschland
In the previous studies, power cycling tests with different junction temperature swings were performed for the Al-clad Cu wires, and significant improvements of the power cycling capability was observed. In this work, power cycling tests with different switch on time were performed for the Al-clad Cu wires. Similar on-time dependency of Al-clad Cu wires compared with aluminium wires was observed.
14:25 System Cost Reduction with Integration of Shunts in Power Modules in the Power Range Above 75 kW
Dipl.-Ing. (FH) Klaus Vogel, Infineon Technologies, Warstein, Deutschland
Cost reduction and increased power density at high lifetime level are the main challenges for the development of new inverter generations. For instance, the electrical performance of IGBTs and diodes has been improved constantly in addition to improved interconnection technologies. A further potential for cost reduction is the introduction of shunts for current measurements in the power modules, replacing hall sensors in the AC bus bar in the inverter power range above 75 kW.
14:50 Cost Effective Direct-Substrate Jet Impingement Cooling Concept for Power Application
Dr.-Phys. Bassem Mouawad, University of Nottingham, Nottingham, Grossbritannien
This work demonstrates a cost-effective manufacturing approach based on the printed circuit board technology to create the impingement cells under direct bonded copper substrate. Results from both computational fluid dynamics simulation and transient thermal test verify the good performance of such jet impingement cooling system under high power density conditions.


Speaker detail

Mr. Nan Jiang
M.Sc. Nan Jiang
Technical University of Chemnitz, Chemnitz, Deutschland
Nan Jiang studied Micro and Nano Systems and graduated from Chemnitz University of Technology (M.Sc) in 2015. After that he joined the Chair of Power Electronics and EMC in Chemnitz University of Technology and started his phd study. His main fields of interest are the advanced packaging materials and their reliabilities.
Dr. Bassem Mouawad
Dr.-Phys. Bassem Mouawad
University of Nottingham, Nottingham, Grossbritannien
Dr Bassem Mouawad received his PhD in 2013 from INSA de Lyon, in France, in Micro and Nanotechnology where he developed innovative assemblies for power electronic packaging. He is currently working as a Research Fellow at the Power Electronics, Machines and Control Group in the University of Nottingham. His current research interests include Embedded Power Electronics packaging, Thermal Analysis of high performance packaging technologies for Wide Band-Gap devices.
Dipl.-Ing. (FH) Klaus Vogel
Infineon Technologies, Warstein, Deutschland
Klaus Vogel received his Dipl.-Ing. degree in electrical engineering from the University of Applied Sciences and Arts in Dortmund in March 2008. He began his career as a Complaint Manager and Failure Analyst in the Quality Department at Infineon Technologies AG in Warstein. Afterwards he moves inside the company and during 4 years he worked as an Application and System Engineer and since the middle of 2014 he is technical marketing manager for power modules.