05. - 07.06.2018
PCIM Europe 2018
Power Electronics | Intelligent Motion | Renewable Energy | Energy Management


Special Session

Materials for Packaging and Thermal Management


Tuesday, 05.06.2018, 11:00 - 12:40 hrs


Brüssel 2


Peter Kanschat, Infineon Technologies, D


11:00 Development of High Temperature Gels
Makoto Ohara, Shin-Etsu Silicones, Wiesbaden, Deutschland
Market requirements to packaging material (silicone gel)
What happens to silicone gel when it's exposed high temperature?
How to overcome these failure modes?
Introduction of the latest high temperature gels and future target
11:25 Silicone Gels for Continuous Operation up to 200C in Power Modules
Thomas Seldrum, Dow Chemicals Company, Seneffe, Belgien
A silicone gel with high temperature resistance (up to 215°C for more than 2000 hours) has been developed. The mechanical softness and high elongation at break, together with the electrical performances have been preserved via formulation engineering and use of additives that can prevent the oxidative degradation mechanisms.
11:50 High Temperature Encapsulation for Smart Power Devices
Dipl.-Ing. Karl-Friedrich Becker, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, Berlin, Deutschland
Research is presented, that provides a detailed description of the high temperature suitability of encapsulants for power electronics encapsulation ? additionally an extended test methodology is described to facilitate future material evaluation for HT or harsh environment use of polymeric materials as encapsulants or base materials is described.
12:15 Next-Generation PPS Grades for Power Module Applications
B.Eng. Christian Schirmer, Toray Resins Europe GmbH, Neu-Isenburg, Deutschland
Greater toughness is sought in PPS (Polyphenylene Sulfide) electrical housings to enable simplified assembly procedures. The development uses proprietary Nanoalloy compounding technology to enhance the mechanical properties of the PPS compounds.
This effort seeks to balance tradeoffs in formulation to maintain comparative tracking performance (CTI 600V) while increasing toughness


Speaker detail

Herr Karl-Friedrich Becker
Dipl.-Ing. Karl-Friedrich Becker
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, Berlin, Deutschland
Karl-Friedrich Becker studied materials science at TU Berlin with a focus on polymer physics; he finished his studies in 1995. In 1996, he joined Fraunhofer IZM, since 2001, he is heading the group Assembly & Encapsulation in the department System Integration and Interconnect Technologies. Recent research is focused on the use of encapsulants/packaging materials for 3D integration, heterogeneous integration, molded smart power modules and material degradation in harsh environment.
Mr. Makoto Ohara
Makoto Ohara
Shin-Etsu Silicones, Wiesbaden, Deutschland
Makoto Ohara graduated Chuo University in Tokyo, Japan in March 2002. He joined Shin-Etsu Chemical Co., Ltd in Tokyo, Japan in February 2007 as a Sales Manager for RTV & TIM products mainly for automotive electronics and semiconductor industries. He moved to Shin-Etsu Silicones Europe B.V. Germany Branch in Wiesbaden, Germany in August 2016 as a Sales & Marketing Manager. He is contributing to European customers and markets with unique and state-of-the-art products of Shin-Etsu Chemical.
Herr Christian Schirmer
B.Eng. Christian Schirmer
Toray Resins Europe GmbH, Neu-Isenburg, Deutschland
After studying Plastics Engineering in Darmstadt, Christian Schirmer started working in the Marketing & Sales Team of Toray Resins Europe in Frankfurt. Responsible for the European market, he works closely with the development teams of EU semiconductor and power module manufacturers. Christian represents the customer's needs within Toray's technology development department, for advancing the PPS product portfolio by anticipating future market trends.
Dr. Thomas Seldrum
Thomas Seldrum
Dow Chemicals Company, Seneffe, Belgien
Dr. Seldrum joined The Dow Chemical Company in 2011 as TS&D Scientist. He developed the Silicon Carbide business with key players in Europe and he is in charge of the development of next generation high temperature encapsulation materials. He is also in charge of the development of thermal dissipation materials for automotive and power electronics industry.