05. - 07.06.2018
PCIM Europe 2018
Power Electronics | Intelligent Motion | Renewable Energy | Energy Management


Poster Session

Thermal Management


Wednesday, 06.06.2018, 15:15 - 17:30 hrs


Pavol Bauer, Delft University of Technology, NL


15:15 Application of Mmc Alsic Thermocompensators in Power Press Pack Diodes and Thyristors
Dipl.-Ing. (FH) Alexey Grishanin, Electrovipryamitel, Saransk, Mordovia, Russische Föderation
This paper presents investigation and test results of power press-pack semiconductors with thermocompensators from metal-matrix composite (MMC) AlSiC and brief description of design and manufacturing technology. Our investigations show possibility of AlSiC-TC application in press-pack power semiconductor design. New thyristors with AlSiC-TC and LTJT have surge current capability 30% higher as conventional devices.
15:15 Reliability of the Power Module Using the Insulated Substrate with Al/C Composite
B.Eng. Kazuhiko Minami, Showa Denko, Oyama City, Japan
In this report, the improvement of reliability is reported by the power module using the insulated substrate with Al/C composite. Aluminum insulated substrate (DAB) with Al/C composite restrain to deform aluminum at heat cycle. From rule of mixtures, Al/C composite of this report is near parallel type. This result is reasonable from Al/C composite structure. In the power module using DAB with Al/C composite, wrinkle is not formed after heat cycle. As CTE of Al/C composite neared by ceramic, thermal stress is reduced and wrinkle is not formed.
15:15 A Development of Resin Insulating Material for High Reliable Enhanced Power Module
Dipl.-Chm. Shinji Amanuma, Hitachi Chemical, Tokyo, Japan
The trends of power module are high power density, downsizing and high reliability. To satisfy these requirements, the thermal management of whole package design is vitally important. Especially, we need to consider high heat dissipation, because Junction temp of device will become higher if power will be higher. This paper introduced two types of new products Which to improve above performance well, namely, Resin Insulated High heat dissipation substrate and Hybrid Encapsulation.
15:15 Experimental Investigation of Gravity-Driven Two-Phase Cooling for Power Electronics Applications
M.Sc. Devin Pellicone, Advanced Cooling Technologies, Lancaster, USA
Passive cooling approaches are ideal for high reliability systems because they require no moving parts and little maintenance. Some gravity-based two-phase cooling solutions provide a higher performance alternative to current passive cooling solutions. This paper will discuss the recent developments and experimental evaluation of a gravity-driven two-phase cooling solution for medium voltage drive applications.
15:15 Integrated Cooling Channels in Direct Bonded Copper Substrate for Silicon Carbide MOSFETs
Alexander Stippich, RWTH Aachen, Aachen, Deutschland
A cooling structure etched directly into a direct bonded copper substrate is examined for semiconductor devices including silicon carbide devices. Simulations are carried out for an initial setup and experimentally verified with measurements. Different material combinations are simulated for silicon carbide devices. By integrating a micro-channel structure, a small and efficient cooling system can be achieved.
15:15 Thermoelectric Cooling for Bare Dies Power Devices Embedded in PCB Substrates
Dr. Shuangfeng Zhang, University of Paris, PARIS, Frankreich
In this paper, solutions such as use of thermal vias, thick PCB copper layer and thermoelectric coolers (TECs) will be discussed and compared to optimize the heat dissipation. And the optimum TEC parameters are analyzed to obtain its maximum coefficient of performance (COP). Controlled experiments have been performed to validate the 3D thermal management models and precision calorimetry method will be applied for accurate measurement of power losses in power devices in order to compare thermal performances of the different cooling solutions.
15:15 Generic Lumped Parameter Thermal Model with Optimized Use of Computational Resources
B.Eng. Joaquim Pinol Bel, University of Applied Sciences Aalen, Aalen, Deutschland
In this paper, a method for efficient computation of generic lumped parameter thermal models is presented. It describes the implementation of thermal model to a given system with a complexity scalable to the available resources. The applied optimization techniques for model computation will be discussed. A performance analysis of the model simulation, regarding the required memory and computing power, will proof that it can be executed in a microcontroller in real-time. A model for an induction machine is presented as an example.
15:15 Methodology and More Accurate Electrothermal Model for Fast Simulation of Power HEMTs
Ing. Ales Chvála, Technical University Bratislava, Bratislava, Slowakei
Presented work introduces an advanced methodology for fast 3-D TCAD electrothermal simulation for analysis of power devices. The proposed methodology allows fast simulation of complex systems from individual semiconductor layers at a frontend up to package and cooling assemblies at a backend. More accurate electrothermal model of power high-electron mobility transistors (HEMTs) is proposed and validated. The influence of the metallization layer geometry on the electrothermal behavior of the multifinger power HEMT is studied.
15:15 A New Transient Thermal Impedance Model for Estimating the Dynamic Junction Temperature of IGBT Modules
Xin Ma, Infineon Integrated Circuit, Beijing, China
The dynamic junction temperature of IGBT module is of vital importance for such as accurate thermal protection and lifetime estimation of power converter system.This paper proposes a new transient thermal impedance model Zth,j_ntc between the junction of IGBT and the built-in NTC thermistor applied to estimate the dynamic junction temperature of IGBT. A case study is also taken as an example to demonstrate the effectiveness of this new model under the system real time operating conditions.


Speaker detail

Mr. Shinji Amanuma
Dipl.-Chm. Shinji Amanuma
Hitachi Chemical, Tokyo, Japan
Shinji Amanuma graduated from the Rikkyo University in Japan in 2009 as a major in Polymer Science. Since from 2009. He has worked for Hitachi chemical in the field of Power Electronics as a Development Engineer for resin insulating technology in consumer electronics, high power LED and Automotive.
Since 2015 he has been in charge of marketing section of Hitachi chemical to organise cooperating some companies from supply chain of Power electronics.
Dr. Ales Chvála
Ing. Ales Chvála
Technical University Bratislava, Bratislava, Slowakei
Ale? Chvála received the M.Sc. and Ph.D. degrees in electronics from the Slovak University of Technology in Bratislava (STUBA), Bratislava, Slovakia, in 2005 and 2009, respectively. He has been a Researcher with the Institute of Electronics and Photonics, STUBA, since 2007. His current research interests include the TCAD and SPICE electrothermal modeling, simulation, and characterization of Si, SiC and GaN-based devices.
Dipl.-Ing. (FH) Alexey Grishanin
Electrovipryamitel, Saransk, Mordovia, Russische Föderation
Alexey Grishanin received the E.Eng. degree from Mordovia State University, Saransk, Russia, in 2004. After graduation, he works at the Scientific and Engineering Center for Power Semiconductor Devices of PJSC Electrovipryamitel. He is the head of department development of bipolar power semiconductors since 2011. Scientific interests include power semiconductor devices (ETT and LTT for phase control, reverse-switching dynistors and thyristors for pulse applications),
Mr. Xin Ma
Xin Ma
Infineon Integrated Circuit, Beijing, China
I received my bachelor degree in electrical engineering and M.S. degree in power electronics and power drive from the China University of Petroleum in 2005 and Institute of Electrical Engineering, Chinese Academy of Sciences in 2008 respectively. I joined Siemens China in 2012 and took over responsibility for the development of medium voltage inverter in large drive BU.From 2014 onward I joined Infineon Beijing and engaged in the work of sineor application engineer of power semiconductors for wind power, GPI and medium voltage drives.
Mr. Kazuhiko Minami
B.Eng. Kazuhiko Minami
Showa Denko, Oyama City, Japan
March 1999 Graduated from Osaka Univercity, JapanApril 1999 Join SHOWA DENKO K.K.I have been in charge of Material Development of Alminum alloy.
Mr. Devin Pellicone
M.Sc. Devin Pellicone
Advanced Cooling Technologies, Lancaster, USA
Mr. Devin Pellicone is the Lead Engineer of Custom Products at Advanced Cooling Technologies, Inc. He has over 8 years of experience developing advanced thermal solutions for a wide range applications. He has a Master's of Science in Mechanical Engineering from Villanova University. Mr. Pellicone has extensive experience developing both active and passive solutions for challenging electronics cooling applications with a particular expertise in evaporative solutions.
Mr. Joaquim Pinol Bel
B.Eng. Joaquim Pinol Bel
University of Applied Sciences Aalen, Aalen, Deutschland
Joaquim Pinol Bel received the B. Eng. degree in Industrial Electronics and Automatics from Universitat Politecnica de Catalunya, Barcelona, Spain, in 2015.
Since 2015, he has been a Research Assistant with the Laboratory of Power Electronics and Electrical Drives at Aalen University, Aalen, Germany. Currently he is working toward the M. Sc. degree in Advanced Systems Design at Aalen University, Aalen, Germany. His main research interests include the thermal modeling and control of electrical drives.
Herr Alexander Stippich
Alexander Stippich
RWTH Aachen, Aachen, Deutschland
Alexander Stippich, research associate at the Institute for Power Electronics and Electrical Drives at RWTH Aachen University, is part of the power electronics group since 2015. Within the scope of his doctorate he predominantly works on the packaging of power semiconductors and the increase of the power density and efficiency of dc-dc converters.
Dr. Shuangfeng Zhang
University of Paris, PARIS, Frankreich
Shuangfeng ZHANG received her M.S. degree of Physics and Electrical Engineering from Paris-sud University, in 2015, respectively. She is currently a PhD student for Power Electronic Systems in laboratory GeePs (Group of electrical engineering, Paris). Her research interests include High-frequency high density power systems, GaN devices applications, modelling and thermal managements for power systems.