05. - 07.06.2018
Power Electronics | Intelligent Motion | Renewable Energy | Energy Management
Thursday, 07.06.2018, 14:00 - 15:40 hrs
Hubert Schierling, Siemens, D
Partial Discharge Measurement in a Motor Winding Fed by a SiC Inverter - How Critical is High dV/dt Really?
This paper develops a sensor system to investigate partial discharge in a motor winding during PWM operation of a SiC inverter with high dV/dt. It is found that even in PWM operation with 41 kV/µs partial discharge only appears if the PMW voltage exceeds the critical voltage found in a state of the art PD test. No additional effect of the high dV/dt was observed! This highly interesting outcome is traced back to material properties and the design of the winding. It opens up new options for SiC in motor drives.
Evaluation of Sinter-Based Joining Technologies on Lead Frame
In this paper, an Ag-sinter based joining technology for chip to lead frame die attach is investigated. The focus will be set on the evaluation of different sinter process parameters, i.e. sinter temperature and pressures, with respect to their reliability. For this reason, characterization of the joint layer and power cycling tests were performed in conjunction with FE analyses. The results will be detailed in the paper and compared to classical solder joint technologies.
On-line Health Monitoring of Wire-Bonded IGBT Power Modules using On-State Voltage at Zero-Temperature-Coefficient
Monitoring the health of IGBT power modules is an enabling technology for predictive maintenance. This paper proposes and tests a circuit and method to measure on-line the on-state voltage at the Zero-Temperature-Coefficient (ZTC) current value. We demonstrate the experimental feasibility to monitor the electrical resistivity increase that is associated with the wire-bond degradation of IGBT power module rated at 150A/1200V driving a sinusoidal current.
First Results of Development of a Lifetime Model for Transfer Molded Discrete Power Devices
Transfer molded devices have shown higher power cycling capability compared to power modules. There is however still a shortage of investigation on power cycling capability of discrete package regarding lifetime impacting parameters. In this work, IGBTs of eight different device types (voltage and current class) in TO 247-3 package from Infineon Technologies AG were used.
Mitsubishi Electric, Rennes Cedex 7, Frankreich
Nicolas Degrenne graduated in electrical engineering from INSA Lyon, France, in 2008. He realized his Ph.D. thesis in the field of bioelectricity harvesting with Laboratoire Ampère and Ecole Centrale Lyon, from 2009 to 2012. Since 2013, he is with the Power Electronic System division of Mitsubishi Electric R&D Centre Europe in Rennes, working as a researcher in the fields of integration, reliability and robustness of power converters and semi-conductor devices.
University of Bayreuth, Bayreuth, Deutschland
Marco Denk received his Master's degree in 'Electrical Engineering' in 2012 and his Ph.D. in 'Power Electronics' in 2016. Currently he is post-doc at the University of Bayreuth. His areas of interest include new and innovative sensor systems for power electronics.
Fraunhofer Istitute ENAS, Chemnitz, Deutschland
Alexander Otto studied Electrical Engineering at Chemnitz University of Technology, which he finished in 2009 by received his Diploma. The topic of his diploma thesis was the development of a test system for characterization of micro mirror devices based on MEMS technology. Since 2009 he is working at Fraunhofer Institute for Electronic Nano Systems ENAS. The main focus of his research work is smart reliability testing of (power) electronic components and modules.
Technical University of Chemnitz, Chemnitz, Deutschland
Guang Zeng, received the M.S. degrees in electrical engineering from Chemnitz University of Technology, Germany, in 2014. He joined Chair of Power Electronics and EMC at Chemnitz University of Technology, Germany in 2015 and he is now pursuing his Ph.D. degree in electrical engineering there. His main research topics are power cycling test, thermal management and lifetime prediction of power electronic devices.