05. - 07.06.2018
PCIM Europe 2018
Power Electronics | Intelligent Motion | Renewable Energy | Energy Management


Oral Session

Advanced Packaging Technologies II


Wednesday, 06.06.2018, 14:00 - 15:15 hrs


München 1


Stefan Linder, Alpiq, CH


14:00 Sintering Cu Bonding Paste: Cycle Reliability and Applications
Dr. Hideo Nakako, Hitachi Chemical, Tsukuba-shi, Ibaraki-ken, Japan
New high reliable die-bonding material has been highly demanded cause of the high temperature operating power device. Our sintering Cu bonded layer have superior bonding reliability than those with high lead solder bonding layers as compered by thermal cycle test and power cycle test. This sintering copper paste curable at temperature of over 225 °C in H2 atmosphere under pressure-less condition. Therefore, it can apply to Cu wire connection and Cu clip connection that are alternative to Al wiring.
14:25 Selective Silver Sintering of Semiconductor Dies on PCB
Fabian Dresel, Fraunhofer Institut für Integrierte Systeme und Bauelementetechnologie IISB, Erlangen, Deutschland
Organic printed circuit boards (PCB) together with standard joining technologies offer a cheap solution for signal and power electronics. These joining technologies reach their limit for high temperatures. This work proposes selective silver sintering as a new joining technology for the mounting of bare die semiconductors directly onto the PCB for high temperature applications. To prove the feasibility a lifetime and reliability test is carried out on prototypes.
14:25 Feasibility of Copper-Based Ribbon Bonding as an Assembly Method for Advanced Power Modules
M.Eng. Stefan Behrendt, FuE University of Applied Sciences Kiel, Kiel, Deutschland
This investigation compares IGBT assemblies interconnected with aluminum-copper and bare copper ribbons to assemblies built with standard methods as benchmark. Assemblies with silver sinter die attach and optimized ribbon bonding were submitted to short power cycles for reliability testing. Reduced coefficient of thermal expansion mismatch and stronger interfaces with these interconnections show improved reliability compared to the benchmark. The new technologies are a promising alternative for advanced power modules.


Speaker detail

Herr Stefan Behrendt
M.Eng. Stefan Behrendt
FuE University of Applied Sciences Kiel, Kiel, Deutschland
Stefan Behrendt works as a project engineer for the "Research and Development Center FH Kiel GmbH". He obtained his M.Eng. in 2015. Currently he is working on the public funded research project called "ReLEEB". In this project the use of inorganic encapsulants in combination with SiC and GaN semiconductors is investigated. This is contributing to his PhD work.
Herr Fabian Dresel
Fabian Dresel
Fraunhofer Institut für Integrierte Systeme und Bauelementetechnologie IISB, Erlangen, Deutschland
Fabian Dresel studied mechatronics at the Friedrich-Alexnader Universität Erlangen-Nürnberg. He finished his studies in 2016 with a M.Sc degree. Since 2016 he is working at Fraunhofer Institute for Integrated Systems and Device Technology IISB in the field of test and reliability.
Dr. Hideo Nakako
Dr. Hideo Nakako
Hitachi Chemical, Tsukuba-shi, Ibaraki-ken, Japan
Hideo Nakako studied at Kyoto University and graduated with a Ph. D in polymer science in 2001. He joined the research laboratory at Hitachi Chemical in 2001. He dispatched and studied gate-insulating material of organic FET at Hitachi Cambridge laboratory from 2005 to 2007. After returning to Hitachi Chemical at 2008, he has been developing the sintering metal materials. His interests include functional materials, metal-organic composites, metallic materials and polymer materials.