05. - 07.06.2018
Power Electronics | Intelligent Motion | Renewable Energy | Energy Management
Wednesday, 06.06.2018, 10:00 - 12:05 hrs
Wolfram Teppan, LEM Intellectual Property SA, CH
Design and Optimization Method of PCB-Integrated Inductors for High-Frequency Converters
Power electronics converters require energy storage components. The DC-DC converters need themagnetic storage components which take a large volume. The new power GaN transistors allow toincrease the operating frequency of the power converter. The consequence is a reduction of the valuesand the dimensions of the passive components mainly the inductors. In this paper, a design methodfor PCB-integrated inductors is proposed. It is based on the optimization approach of inductors volume.
Simulating the Parasitic Capacitance of Inductive Components
A simulation based method for calculating the parasitic capacitance of inductive devices is presented. The method allows the consideration of the influence of the magnetic material which is very important for practical applications. Additionally, different winding techniques can be taken into account in the calculations. We show with an example how the winding technique affects the overall parasitic capacitance.
Future Winding for Next Power Electronic Generation
In this paper a new winding technique is presented. The new design offers significant advantages in life time, losses, potential control, cooling, current density and cost.
Rippel Current Determination for Inductors in a DC/DC Converter Both With and Without Magnetic Bias
A study of inductor models applicable in a DC/DC converter is presented. The main focusis to determine the optimum ripple current with respect to given boundary conditions e.g. asaturation flux density with and without magnetic bias. It becomes clear that different fluxdensities require different ripple current determination. It is a guideline for determination optimalripple currents for different inductor designs.
Development of Accelerated Testing of Thermal Degradation in Metallized Ceramic Substrates for SiC Power Modules
In order to shorten the testing time of thermal cycling for metallized ceramic substrates, a new accelerated fatigue test was developed. Maximum tensile stress in the ceramics during thermal cycle was estimated by FEM analysis. The stress swing in the ceramic substrates during the thermal cycling was simulated by 4-point bending the test piece repeatedly at a constant temperature. The time to failure by repeated loading for some ceramic substrates was about 1/100 of the time to delamination of the copper plate by the thermal cycling.
Spezial-Transformatoren-Stockach, Stockach, Deutschland
Tobias Appel studied electrical engineering from 2006 to 2010 at the University of Applied Sciences - Regensburg where he became a graduate engineer in 2010. From 2010 to 2014 he works as research assistant at the Institute of Electrical Power Engineering at the University of Rostock. He obtained his PhD degree in power electronics in November 2014. Since Oktober 2014 he works as research engineer at the STS GmbH \& Co.KG, Germany
University of Lille, Villeneuve d'Ascq, Frankreich
Ammar Chafi is a PhD student between university of Lille in France and university of Sherbrooke in Canada. He received Master degrees in Power Electrical from National Polytechnic Institute of Grenoble, France, in 2016, and the Eng. degree in electrical engineering from the National Polytechnic of Alger, Algeria, in 2015.
BLOCK Transformatoren-Elektronik, Verden (Aller), Deutschland
Dr. Dennis Kampen received the diploma in Electrical Engineering from University of Bremen in 2006 and his Ph.D. at University of Stuttgart in 2012. At BLOCK he was area manager of the department “Advanced R&D” from January 2007-2017. Since 2017 he is general manager research and innovation at BLOCK.
AIST, Nagoya, Japan
Dr. Miyazaki is a senior researcher of National Institute of Advanced Industrial Science and Technology, AIST, Japan. He joined AIST in 2000, where he directed his research to high performance engineering ceramics. His recent activity focuses on developments of mechanical evaluation technique for the specific engineering ceramic products, such as ceramic bearing ball and thin ceramic substrates, etc.
EPCOS, Heidenheim an der Brenz, Deutschland
Stefan Schefler received his diploma in electrical engineering from the University of cooperative education Saxony, Germany in 2003. He worked 3 years for Advanced Micro Devices AMD in modeling and simulation of integrated analog circuits. Since 2004 he drives the simulation activities at the EPCOS AG in the magnetics business group. The paper is based on his current work for the public funded project InSeL - EMI reduced power electronics.