05. - 07.06.2018
PCIM Europe 2018
Power Electronics | Intelligent Motion | Renewable Energy | Energy Management


Board of directors


from left to right: Eric Favre, Uwe Scheuermann, Johann Walter Kolar, Leo Lorenz, Philippe Ladoux, Jean-Paul Beaudet, Jose-Mario Pacas


Prof. Dr. Leo Lorenz  

Prof. Dr. Leo Lorenz,
ECPE, Germany

Chairman since May 2010

  • Academic studies at the TU Berlin
  • Doctoral studies at the Federal University of Munich
  • Nominated to become a Professor for System Integration at the University of Ilmenau
  • Focus: power semiconductors SMART Power including power electronics system engineering


Dr. Eric Favre  

Dr. Eric Favre,
Director R&D,
IMI-Precision Engineering, Switzerland

  • Academic and doctoral studies at the Federal Institute of Technology in Lausanne
  • Focus: Electric motors, sensors and passive components. Electric drives’ and power electronics’ applications
Prof. Dr. Johann Walter Kolar  

Prof. Dr. Johann Walter Kolar,
Head of the Power Electronic Systems Laboratory, ETH Zurich, Switzerland

  • Academic and doctoral studies at the University of Technology Vienna
  • Focus: power electronics, drive systems and smart grids


Prof. Dr. Philippe Ladoux  

Prof. Dr. Philippe Ladoux,
Plasma and Energy Conversion Laboratory, LAPLACE
University of Toulouse, France

  • Academic and doctoral studies at the National Polytechnic Institute of Toulouse
  • Focus: new topologies for high-performance applications,
    power electronics for railway operators
Prof. Jose Mario Pacas  

Prof. Dr. Jose Mario Pacas,
Professor for power electronics and electric drives,
University of Siegen, Germany

  • Academic and doctoral studies at the University of Karlsruhe
  • Focus: Motion Control, Industrial Drives, Power Converters



Prof. Dr. Uwe Scheuermann

Prof. Dr. Uwe Scheuermann,
Senior Manager Product Reliability, Semikron Elektronik GmbH, Germany and
Honorary professor at the FAU Erlangen/Nuremberg, Germany

  • Studies and Promotion at the TU Braunschweig
  • Focus: Power electronic packaging, Reliability of power electronic systems, Simulation and Modeling