05. - 07.06.2018
Nürnberg
SMT Hybrid Packaging 2018
Systemintegration in der Mikroelektronik

 
 
 

Tutorial 6 (English)

Thermal management and reliability for electronic systems: Modern concepts of thermal characterization, failure analysis and technology

Termin

Dienstag, 05.06.2018, 14:00 - 17:00 Uhr

Raum

Room Krakau

Beschreibung

14:00 Thermal management and reliability for electronic systems: Modern concepts of thermal characterization, failure analysis and technology
Prof. Dr. Bernhard Wunderle, Technische Universität Chemnitz, Chemnitz, Deutschland
Dr.-Ing. Matthias Hutter, Fraunhofer Institut für Zuverlässigkeit und Mikrointegration IZM, Berlin, Deutschland
Marcus Hildebrandt, Fraunhofer-Institut für Elektronische Nanosysteme, Chemnitz, Deutschland
Mohamad Abo Ras, Berliner Nanotest & Design, Berlin, Deutschland
Corinna Grosse, Berliner Nanotest & Design GmbH, Berlin, Deutschland
Dr.-Ing. Daniel May, Technische Universität Chemnitz, Chemnitz, Deutschland
Dr.-Ing. Ralph Schacht, Brandenburgische Technische Universität Cottbus-Senftenberg, Senftenberg, Deutschland

Thermal management and thermo-mechanical reliability must be treated together during the development and manufacture of electronic systems. This concerns the topics of design, technology, testing and quality assurance during production. For modern thermal assembly and interconnection technology concepts in micro- and power electronics, fast and non-destructive characterization methods are required at every stage and at every level of complexity in order to validate design and performance and to ensure reproducibility. The aim of the tutorial is therefore to present new developments in the field of thermal characterization methods, which can be used for the evaluation of thermal performance as well as for failure analysis and quality assurance of modern thermal management concepts for electronic systems. Based on practice-relevant examples from R & D, current and forward-looking assembly and interconnection technology concepts for thermal management will be given, modern methods of thermal characterization and non-destructive failure analysis will be presented at material, component and system level and evaluated in comparison to standard techniques. In doing so, the physical basics are treat with as well as application-relevant knowledge.

Focus:
- AVT concepts for thermal management: gluing, soldering, sintering and quality testing
- Deformation and failure analysis at the component and system level
- Thermal characterization of materials and interfaces by means of static and transient processes on technically relevant surfaces
- 3 Omega method: Simple and accurate method for characterizing the thermal conductivity and diffusivity of pastes, adhesives and composites
- In-situ monitoring of damage at interfaces by means of delamination chip
- Active IR-Thermography: Non-destructive error analysis for various assembly and interconnect technology concepts
- Thermal characterization at the system level and connection to the fluidics (CFD)

Target Group
- Experts from R & D and production of electronic systems
- Professionals and decision makers in the fields of thermal management, reliability, failure analysis, quality assurance in SMEs and industry
- Material manufacturer of thermal interface materials (TIM)

Referenten

Herr Mohamad Abo Ras
Mohamad Abo Ras
Berliner Nanotest & Design, Berlin, Deutschland
Mohamad Abo Ras studied at University of Applied Sciences (TFH) in Berlin, Germany and received his Diploma and Master degrees in Applied Physic / Medical Engineering. During and after his studies he worked at Fraunhofer IZM in the field of thermal characterization of material and components. Since 2008 he is working for the Berliner Nanotest und Design GmbH. His expertise is development and appliance of test equipment for material characterization and non-destructive failure analysis of electronic components and systems. Since 2017 he is the Chief Executive Officer (CEO) of Berliner Nanotest und Design GmbH.
Frau Dr. Corinna Grosse
Corinna Grosse
Berliner Nanotest & Design GmbH, Berlin, Deutschland
- Vocational training as material tester at the Federal Institute for Materials Research and Testing (BAM), Germany.
- Studies of Physics at the Humboldt-Universität zu Berlin, Deutschland.
- Research assistant at the group Novel Materials at the Humboldt-Universität zu Berlin.
- 2016: graduation to doctor for natural sciences (Dr. rer. nat.) in experimental physics at the Humboldt-Universität zu Berlin about the structure and electrical properties of superconducting multilayers.
- Since 2016: Project leader for thermal characterization using the 3-omega method at the Berliner Nanotest und Design GmbH, Germany.
Herr Marcus Hildebrandt
Marcus Hildebrandt
Fraunhofer-Institut für Elektronische Nanosysteme, Chemnitz, Deutschland
He started his apprenticeship as material tester in 2002 and finished it in 2006 at the Fraunhofer IWU (Chemnitz). After completion, he worked at Fraunhofer IWU until 2010 and was involved in the experimental parameter identification during metal sheet forming. Following this, he attended the state school for product and design technology (Selb) and graduate as a "state-certified technician for testing and materials technology". Since his graduation, he is employed at the Fraunhofer ENAS with main field of activity: analysis of connection technology with regard to the lifetime of integrated systems.
Dr. Matthias Hutter
Dr.-Ing. Matthias Hutter
Fraunhofer Institut für Zuverlässigkeit und Mikrointegration IZM, Berlin, Deutschland
Matthias Hutter received the Dipl.-Ing. degree in materials science and technologies from the University of Erlangen, Germany, in 1997 and his Dr.-Ing. from the Technical University of Berlin, Germany, in 2009. Since 1997 he has been working as a R&D engineer, project manager and group manager at the Fraunhofer IZM in Berlin, Germany, in the field of microelectronics packaging. His work has focused on the development of solder interconnection technologies and Ag sintering technologies especially in the fields of optoelectronic and RF, power electronics and board interconnection. Currently he is a group manager for metallic interconnection technologies.
Herr Dr. Daniel May
Dr.-Ing. Daniel May
Technische Universität Chemnitz, Chemnitz, Deutschland
- Studied Micro System Technology in Berlin, Diploma Degree in 2004.
- In 2006 Master's Degree in Computational Engineering
- Since 2009 he is research fellow at the Chair Materials and reliability of Microsystems of Chemnitz Technical University.
2015 PhD "Transient methods of infrared thermography for failure analysis in microelectronic packaging"
- Current focus of interest :
- in the field of coupled thermo-electrical measurements
- transient thermal effects applied in the field of failure analysis in electronic packaging
Herr Dr. Ralph Schacht
Dr.-Ing. Ralph Schacht
Brandenburgische Technische Universität Cottbus-Senftenberg, Senftenberg, Deutschland
Ralph Schacht studied telecommunication engineering at Deutsche Bundespost University of Applied Sciences and electrical engineering at the Technical University Berlin and obtained his Phd 2002 in electrical engineering at the TU Berlin. From 2001 to 2012 he joined the Fraunhofer IZM, where he was responsible for the Thermo-Electric-Testing Lab. In 2006 he became a full professor in the field of ?Electronic circuit engineering?, first to the Lausitz University of Applied Sciences and since 2013 has been a full professor at the Brandenburg Technical University Cottbus-Senftenberg. Since 2013 he has been working as a consultant and project manager at the Fraunhofer ENAS as well as director in the Joint Lab Berlin for technical safety. From 2010 to 2013 he was Vice-President for Research at the Lausitz University of Applied Sciences. His scientific focus is the development of reliable cooling concepts for (micro-) electronic structures and systems. The focus is on the modeling and simulation of coupled thermo-electric and air cooled systems and their experimental verification, as well as the non-destructive testing by means of active IR thermography.
Herr Professor Bernhard Wunderle
Prof. Dr. Bernhard Wunderle
Technische Universität Chemnitz, Chemnitz, Deutschland
Bernhard Wunderle studied Physics in Tübingen (Germany), York (UK) and Salerno (Italy). In 1998 he received his diploma in theoretical physics from the University of Tübingen. From 1999 on he was with Robert Bosch Ltd, where he was concerned with reliability studies in advanced electronic packaging for automotive applications, a work he received his Ph.D. for from the Technical University of Berlin in 2003. In 2008 he spent several months working with Oxford Materials in the UK. Since 2009 he is a full professor at the Chemnitz University of Technology/Germany for materials and reliability. The main focus of his group is on material characterisation and reliability in experiment and simulation, with particular interest in structure-property correlations in the micro- and nano domain. He has longstanding experience in methods of multi-field and multi-scale simulation. At the same time he is a member of Fraunhofer ENAS and co-founder and director of Joint Lab Berlin, where he is leading a team working in the field of thermal management concepts. He is the author and co-author of more than 130 conference papers and articles in scientific journals. Bernhard Wunderle currently supervises 15 Ph.D. students, some of them within an industrial cooperation.


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