05. - 07.06.2018
Nürnberg
SMT Hybrid Packaging 2018
Systemintegration in der Mikroelektronik

 
 
 

Tutorial 5 (English)

Printed Circuit Board Failures - Causes and Cures

Termin

Dienstag, 05.06.2018, 14:00 - 17:00 Uhr

Raum

Room Stockholm

Beschreibung

14:00 Printed Circuit Board Failures - Causes and Cures
Bob Willis, Bobwillis.co.uk, Chelmsford, Grossbritannien
The printed circuit board is the building block of any electronic assembly and as such must exceed specification and be totally compatible with the assembly processes used in modern assembly. Failures in PCBs can be cosmetic, often the most common reason for rejection in manufacture or assembly. Failures can be found during assembly and final test which are not ideal but much better than field returns.

In his presentation Bob will highlight test methods you can try and tricks of the trade to understand how PCBs can fail and how to eliminate many of the common causes. During the workshop there is a Q&A session which provides ample time for all delegate questions to be answered. However if a delegate has a process example they would like cover in the workshop it will need to be provided by email before the session.

Selected topics covered
Through hole plating failures
CAF contamination shorts
PCB Delamination
Nickel/Gold - Black pad & Black Tar
Inner layer separation
Solder mask cracking
Outgassing
Need for product specifications
Auditing a PCB supplier

Referenten

Mr. Bob Willis
Bob Willis
Bobwillis.co.uk, Chelmsford, Grossbritannien
Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Technical Committee. Although a specialist for companies implementing Surface Mount and Lead-Free Technology Mr Willis provides training and consultancy in most areas of electronic manufacture. He runs theory and hands on workshops and monthly online webinars worldwide


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