20. - 22.02.2018
Düsseldorf
EMV 2018
Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit

 
 
 

Workshop 7

ESD-Protection strategies for modern interfaces in automotive and consumer applications

Termin

Donnerstag, 22.02.2018, 09:00 - 12:00 Uhr

Beschreibung

09:00 ESD-Protection strategies for modern interfaces in automotive and consumer applications
Prof. Dr.-Ing. Jens Werner, Jade Hochschule Wilhelmshaven/Oldenburg/Elsfleth, Wilhelmshaven, Deutschland
Dipl.-Ing. (FH) Björn Scheffler, Nexperia Germany GmbH, Hamburg, Deutschland
Dr.-Ing. Jan Preibisch, Nexperia Germany GmbH, Hamburg, Deutschland
The workshop starts with a brief introduction into the basic principles of electrostatic discharge (ESD) and gives insight into relevant protection concepts for modern interfaces in the field of automotive applications: Classic "in-vehicle" networks - e.g. CAN, LIN, FlexRay and BroadR-Reach as well as typical interfaces from consumer industry (HDMI, USB, LVDS, . . .), which are increasingly integrated in modern vehicles.
Topologies of ESD protection concepts are discussed (simple PN diodes, SCR structures with / without snap-back, ESD protection combined with EMI filters, etc.). Test methods which are used for the characterization of ESD protection components are explained in detail. This allows to understand whether an ESD protection itself not only surpasses an ESD discharge without damage, but also protects reliably a system component (like a CMOS-SoC). The dynamic resistance of both the protective and the system components is of paramount importance. The corresponding measuring method TLP (transmission line pulse) is explained in detail by examples. Another kind of characterization is the clamping behavior, which is usually determined by the standard IEC / EN 61000-4-2 pulse. This will be demonstrated with a hands-on test setup.
Subsequently, interface-specific protection concepts and requirements are discussed (USB 2/3, Aux-In, OBD, CAN, LIN, Flexray, BroadR-Reach). The impact of ESD protection components with respect to the signal integrity analysis (SI) of high-speed interface has to be considered in the design phase. An insight is given how the data integrity can be ensured by means of Spice models.
This workshop addresses developers and development-oriented managers in the automotive sector. However, basic principles and general strategies are easily transferable to other sectors of the electronic industry.

Referenten

Dr.-Ing. Jan Preibisch
Nexperia Germany GmbH, Hamburg, Deutschland
Dipl.-Ing. (FH) Björn Scheffler
Nexperia Germany GmbH, Hamburg, Deutschland
Herr Professor Jens Werner
Prof. Dr.-Ing. Jens Werner
Jade Hochschule Wilhelmshaven/Oldenburg/Elsfleth, Wilhelmshaven, Deutschland
Jens Werner became professor at Jade University of Applied Sciences, Wilhelmshaven, in March 2014. He is responsible for the RF/Wireless/EMC lab and teaches related subjects for electric and communication engineers. From 2001 to 2014 he worked in various positions with Philips Semiconductors (since 2006 NXP Semiconductors) in Hamburg: System Architect Hardware (TV frontend), RF Simulation Expert (Automotive Tuner) and Technical Marketing Manager (ESD protection + EMI filter). He is IEEE member and secretary of the IEEE German EMC chapter.


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