06. - 08.05.2014
SMT Hybrid Packaging 2014
System Integration in Micro Electronics
18.03.2014The Exhibition JournalThe Hüthig Verlag is the publisher of the official Exhibition journal of the SMT Hybrid Packaging 2014. More information are to be found under the Media Kit
05.03.2014ECWC13 conference registration online

The registration for the ECWC13 conference is now available online. 123 presentations in 26 session provide a comprehensive overview about the current topics in the industry.

ECWC13 Registration
03.02.2014Entry for free

Visitors who register online for the exhibition ticket will get free access.
Register for a day ticket
Redeem your entry voucher