Conference and Tutorials

Parallel to the exhibition, the SMT Hybrid Packaging conference and tutorials are the most important platform for information and networking in the field of micro electronics manufacturing in Europe.

The program consists on the one hand of a high-class, user-oriented conference day in German, which deals with current issues. On the other hand a large number of practice-oriented half-day tutorials in German and English offers information and results at first hand.

International experts from industry and science present current and future developments in electronics manufacturing, offer solutions for special problems and are inviting all delegates to discuss and to exchange their experiences.

 Co-operation Partner

The EIPC represents the European PCB industry on the World Electronic Circuits Council (WECC). It is regional trade associations such as ours who are active in Asia and North America who join with us in supporting the global PCB industry in technological, economic and environmental matters. In addition, the EIPC manages the JISSO European Council, a part of JISSO International, which harmonises standards in the electronics supply chain from the chip design to the finished electronic equipment.

Mark your calendar!