Welcome to the 
SMT Hybrid Packaging Conference.

In 2014, the 13th Electronic Circuits World Convention (ECWC13) will take place parallel to the SMT Hybrid Packaging exhibition.

The Electronic Circuits World Convention is held every three years in different parts of the world. ECWC12 took place during the TPCA show in Taiwan. ECWC13 is scheduled to be held in Nuremberg in Germany. The conference will feature approximately 30 sessions with 130 speeches, poster session, best paper awards and an extensive social program.

The conference language will be English.

The SMT Hybrid Packaging Conference with Workshops and Tutorials will take place again in its usual form in 2015. 

To the ECWC13 Homepage