Conference and Tutorials

Parallel to the exhibition, the SMT Hybrid Packaging conference and tutorials are the most important platform for information and networking in the field of micro electronics manufacturing in Europe.

The conference will for one day focus on presentations and discussions on the topic „Technology of Printed Circuit Boards for Electrical Mobility“. In addition to that there will be, as usual, practice-oriented half-day tutorials providing basic and expert knowledge.  The extensive program will offer trend setting topics with clear advantages for users.

International experts from industry and science present current and future developments in electronics manufacturing, offer solutions for special problems and are inviting all delegates to discuss and to exchange their experiences.

 Co-operation Partner

The EIPC represents the European PCB industry on the World Electronic Circuits Council (WECC). It is regional trade associations such as ours who are active in Asia and North America who join with us in supporting the global PCB industry in technological, economic and environmental matters. In addition, the EIPC manages the JISSO European Council, a part of JISSO International, which harmonises standards in the electronics supply chain from the chip design to the finished electronic equipment.