Conference Program SMT Hybrid Packaging 2013
Programme available December 2012
The SMT Hybrid Packaging conference is the most important platform for information and networking in the field of microelectronics manufacturing in Europe. International experts from industry and science
- present current and future developments in electronics manufacturing
- offer solutions for special problems
- and are inviting all delegates to discuss and exchange their experiences.
for download (pdf)
Do you have any questions or suggestions concerning the conference program?
Then please contact Nora Sollfrank by phone at +49 711 61946 -75 or via our
contact formular.
