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16. - 18.04.2013
Nuremberg
SMT Hybrid Packaging 2013
System Integration in Micro Electronics

 
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Proceedings SMT Hybrid Packaging

All technical papers presented at the SMT Hybrid Packaging conference 2011 are available in an annual proceeding book, incl. CD ROM. If you could not join the conferences take advantage of the presented knowledge by ordering the proceedings! 
Please note, that the papers published in the proceeding book are in German.

Table of Content Proceedings 2012
Table of Content Proceedings 2011
Table of Content Proceedings 2010
Table of Content Proceedings 2009
Table of Content Proceedings 2008

Older editions can be ordered on demand. Ms. Christina Schmidt will be happy to assist you at phone +49 711 61946-22.

I herewith place a firm order as follows
















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Item

Title Unit price net (EUR) Amount Total units
net (EUR)
Tagungsband SMT Hybrid Packaging 2012
Systemintegration in der Mikroelektronik		 55,14
Tagungsband SMT/HYBRID/PACKAGING 2011
Systemintegration in der Mikroelektronik
- Zuverlässigkeit multifunktionaler Elektronikbaugruppen –
Moderne Analysemethoden und Teststrategien
(150 pages incl. CD ROM, papers in German)
ISBN 978-3-18-990094-1		 55,14
Tagungsband SMT/HYBRID/PACKAGING 2010
Embedding-Technologien und ihre Wertschöpfungskette bei elektronischen Baugruppen
(160 pages incl. CD ROM, papers in German)
ISBN 978-3-8007-3226-5		 23,36
Tagungsband SMT/HYBRID/PACKAGING 2009
Fertigung von elektronischen Baugruppen auf flex und starr-flex Basis
(160 pages incl. CD ROM, papers in German)
ISBN-Nr. 978-3-8007-3156-5		 23,36
Tagungsband SMT/HYBRID/PACKAGING 2008
Fertigung elektronischer Baugruppen für die Automobilelektronik
- Trend und Klimaanforderungen, Fertigungstechnologien
(150 pages incl. CD ROM, papers in German)
ISBN-Nr. 978-3-8007-3093-3		 23,36
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