Call for Tutorials 2012
The Call for Tutorials for SMT Hybrid Packaging 2012 is opened. Present your expert knowledge at Europe’s leading exhibition and conference for System Integration in Micro Electronics from 8 – 10 May 2012.
Share your expertise with competent peers.
Present a Tutorial at SMT Hybrid Packaging and get benefits from the direct exchange of new technology, current results of research and future products. Your presentation will be seen by experts and decision makers of the electronics industry, especially from the departments Design and Development, Production as well as Quality Management. 35% of the participants are Executive Employees.
Your benefits as a speaker:
- Presentation platform with a highly-qualified audience
- Direct exchange of new technology, current results of research and future products
- Networking with international experts from industry and science
- Invitation to the Get Together and to the Committee and Speakers’ Dinner
- Publication of your tutorial title, name and company in the conference program, conference flyer and exhibition catalogue
- Free admission to the exhibition and benefit for the conference and other tutorials
Make valuable contacts and expand your network.
We cordially invite you to submit an abstract concerning one of the following topics.
Berlin, July 2011
Your sincerly,
Prof. Dr. Klaus-Dieter Lang
Fraunhofer Institute for Reliability and Microintegration, Berlin
Committee Chairman SMT Hybrid Packaging
