Welcome to SMT Hybrid Packaging 2014
SMT Hybrid Packaging is Europe´s leading event on System Integration in Micro Electronics.
Meet the industry's leading companies for SMT-Equipment, Components and SMT-Services from 6 - 8 May 2014 in Nuremberg, Germany.
With 32% foreign exhibitors, the event offers not only a wide, but also an international spectrum. The perfect platform to get the latest information on newest trends and developments!
Supplier of the SMT-industry offer products, solutions and services in the field of Electronic Manufacturing. Find out more about the exhibition topics’ spectrum in detail.
In 2014, the EIPC (European Institute of Printed Circuits) will be hosting the 13th Electronic Circuits World Convention (ECWC13) in cooperation with Mesago Messe Frankfurt GmbH. The event will take place in Nuremberg, Germany, from 7 - 9 May alongside SMT Hybrid Packaging which will take place from 6 - 8 May.