Welcome to SMT Hybrid Packaging 2012
SMT Hybrid Packaging is Europe´s
leading event on System Integration in
Micro Electronics.
Meet the industry's leading companies
for SMT-Equipment, Components and
SMT-Services from 8 - 10 May 2012 in
Nuremberg, Germany. With 32% foreign
exhibitors, the event offers not only a
wide, but also an international spectrum.
The perfect platform to get the latest
information on newest trends and
developments!
Exhibition topicsSupplier of the SMT-industry offer products, solutions and services in the field of Electronic Manufacturing. Find out more about the exhibition topics’ spectrum in detail.
ConferenceThe SMT Hybrid Packaging conference is the most important platform for information and networking in the field of micro electronics assembly in Europe.
