Welcome to SMT Hybrid Packaging 2013
SMT Hybrid Packaging is Europe´s leading event on System Integration in Micro Electronics.
Meet the industry's leading companies for SMT-Equipment, Components and SMT-Services from 16 - 18 April 2013 in Nuremberg, Germany.
With 32% foreign exhibitors, the event offers not only a wide, but also an international spectrum. The perfect platform to get the latest information on newest trends and developments!
Exhibition topicsSupplier of the SMT-industry offer products, solutions and services in the field of Electronic Manufacturing. Find out more about the exhibition topics’ spectrum in detail.
ConferenceThe SMT Hybrid Packaging conference is the most important platform for information and networking in the field of micro electronics assembly in Europe.
