Lectures and presentations
The forums are the ideal platform for information on newest trends and developments with vendor presentations and panel discussions.
In 2014, the 13th Electronic Circuits World Convention (ECWC13) will take place in conjunction with SMT Hybrid Packaging 2014. Its topics will focus on electronic equipment and PCB manufacturing, set against a background of knowledge of the global demand, new processes and technologies required, and the changing market dynamics. Other SMT Hybrid Packaging topics will also be addressed.
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