06. - 08.05.2014
Nuremberg
SMT Hybrid Packaging 2014
System Integration in Micro Electronics

 
 
 

Welcome to the Mesago press service

The Press Service provides you with comprehensive material by the organizer and the exhibitors for your editorial coverage. You can also find the schedule of press conferences in advance or during the event.

Please call or email us, if you have any requests for an interview, statements and further information about the company and the event.

Our photo collection gives you a comprehensive idea of the show. A more downloads option for your reports are available under Press Service/Photos

ECWC13 Call for Papers online
 
 
 
ECWC13 welcomes papers along the entire packaging and PCB production chain.

Topics

Submission

 
SMT Hybrid Packaging 2013 with positive results
 
 
 
A growth of more than 20% compared to 2012 confirmed the new concept of the SMT Hybrid Packaging conference.