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1. Production preparation / preproduction
2. Circuit carriers and processing equipment
3. Manufacturing equipment for components and modules
4. Test equipment for assemblies
5. Process and equipment testing
6. Material testing
7. Reliability test equipment
8. Manufacturing supporting equipment
9. Cable and cable assembly
10. Materials and components for thermal management
11. Components and modules
12. Computer aided design tools
13. Development services
14. Manufacturing services
15. Technology development, consulting and training
16. Used SMT-Equipment
17. Others
1.1.
Incomming goods inspection
1.1.1.
Light microscopes
1.1.2.
Magnifier lamps
1.2.
Marking and labeling equipment
1.2.1.
Labels
1.2.2.
Label printer
1.2.3.
Label application
1.2.4.
Laser marking
1.2.5.
Barcode solutions
1.2.6.
RFID solutions
1.3.
Component loading
1.3.1.
Component preparation equipment
1.3.2.
Inertia belt reel
1.3.3.
Heat sealing machines
1.3.4.
Magazining units
1.3.5.
Carrier/blister tapes
2.1.
Circuit carrier and substrate materials
2.1.1.
Ceramic circuit carriers
2.1.1.1.
Ceramic substrates and circuits
2.1.1.2.
LTCC tape materials and circuits
2.1.1.3.
Direct bonded copper substrates
2.1.2.
FR4 circuit carriers
2.1.2.1.
Resins
2.1.2.2.
Laminates
2.1.2.3.
Single and multilayer substrates
2.1.2.4.
PCB with embedded components
2.1.2.5.
Thick copper PCB
2.1.2.6.
Heatsink PCB
2.1.3.
Flexible circuit carriers
2.1.4.
3 dimensional circuit carriers
2.1.4.1.
3D MID
2.1.5.
Circuit carrier for special purposes
2.1.5.1.
High temperature circuit carriers
2.1.5.2.
High frequency circuit carriers
2.1.5.3.
High current circuit carriers
2.1.5.4.
High density interconnect circuit carriers
2.1.5.5.
Optical/electro-optical circuit carrier
2.1.6.
Other substrates
2.1.6.1.
Alumnium circuit carriers
2.1.6.2.
IMS substrates
2.1.6.3.
Copper laminated metal substrates
2.1.6.4.
Photo-sensitive substrates
2.2.
Mechanical processing of circuit carriers
2.2.1.
Drilling and routing
2.2.1.1.
Drilling and routing machines
2.2.1.2.
Drills, routers
2.2.2.
Depaneling machines
2.2.2.1.
Scribing machines
2.2.2.2.
Saws
2.2.2.3.
Punching system and equipment
2.2.2.4.
Plate shears
2.2.2.5.
Laser depaneling machines
2.2.3.
Brushing machines
2.2.4.
Multilayer presses
2.2.5.
Laminators/rolling mills
2.3.
Stucturing of circuit carriers
2.3.1.
Coating equipment
2.3.2.
Plating equipment
2.3.3.
Exposure and plotting
2.3.3.1.
Photo plotters
2.3.3.2.
Circuit board plotter
2.3.3.3.
Development equipment
2.3.3.4.
Stripping machines
2.3.3.5.
Laser structuring
2.4.
LTCC/HTCC processing equipment
2.4.1.
Laser trimming
2.5.
Molding
2.5.1.
Mold presses
2.5.2.
Molding tools
2.5.3.
Cutting/punching presses
2.5.4.
Cutting/punching tools
2.5.5.
Moulding compounds
2.5.6.
Leadframes
3.1.
Material deposition
3.1.1.
Template and screen print
3.1.1.1.
Template and screen printers
3.1.1.2.
Templates and screens
3.1.1.3.
Sweegees
3.1.1.4.
Screen and template print equipment
3.1.1.5.
Screen and soldering frame cleaner
3.1.1.6.
Self-mounting systems
3.1.1.7.
Thick film inks
3.1.1.8.
Soldering pastes
3.1.1.9.
Adhesives
3.1.2.
Dispensing and mixing
3.1.2.1.
Dispensing machines
3.1.2.2.
Dispensing accessories
3.1.3.
Encapsulants
3.1.3.1.
Globtop materials
3.1.3.2.
Potting materials
3.1.3.3.
Underfiller
3.1.4.
Conformal coating
3.1.4.1.
Conformal coating systems
3.1.4.2.
Conformal coatings
3.1.5.
Jetting
3.1.5.1.
Ink jetter
3.1.5.2.
Paste jetter
3.1.5.3.
Solderpaste jetter
3.2.
Balling
3.2.1.
Manual/semiautomatic balling systems
3.2.2.
Fully automatic balling systems
3.3.
Placement machines and assembly stations
3.3.1.
Manual/semiautomatic SMT-insertion machines
3.3.2.
Fully automatic SMT-insertion machines
3.3.3.
3D assembly equipment
3.3.4.
Positioning systems
3.3.5.
Special assembly stations
3.3.6.
Assembly tools and benches
3.4.
Bonding
3.4.1.
Diebonder
3.4.2.
Wire bonder
3.4.2.1.
Wire bonding machines
3.4.2.2.
Wire bonding tools
3.4.2.3.
Bond wires
3.4.2.4.
Ultrasonic generators
3.4.2.5.
Ultrasonic transducer systems
3.5.
Soldering
3.5.1.
Reflow soldering systems
3.5.2.
Vapor phase soldering systems
3.5.3.
Wave soldering systems
3.5.4.
IR soldering systems
3.5.5.
Laser soldering systems
3.5.6.
Selective soldering systems
3.5.7.
Special soldering systems
3.5.7.1.
Pulse type soldering systems
3.5.7.2.
Induction soldering systems
3.5.7.3.
Plasma soldering systems
3.5.7.4.
Spot soldering systems
3.5.8.
Soldering irons
3.5.8.1.
Hot bar soldering systems
3.5.8.2.
Light beam soldering systems
3.5.8.3.
Nitrogen handsoldering stations
3.5.8.4.
Hand wave soldering systems
3.5.8.5.
Hot air soldering systems
3.5.9.
Soldering materials
3.5.9.1.
Solders
3.5.9.2.
Soldering paste
3.5.9.3.
Preforms
3.5.9.4.
Solder wires
3.5.9.5.
Solder spheres
3.5.10.
Fluxes
3.5.11.
Soldering auxiliary equipment
3.5.11.1.
Soldering masks
3.5.11.2.
Soldering frames
3.5.11.3.
Soldering aids
3.5.11.4.
Solder tip cleaning equipment
3.5.11.5.
Solder wire feeder
3.5.12.
Solder recovery
3.5.13.
Solder analysis
3.6.
Adhesive bonding
3.6.1.
Adhesives
3.6.1.1.
SMD adhesives
3.6.1.2.
Conductive adhesives
3.6.1.3.
Die attach adhesives
3.7.
Hardening
3.7.1.
UV-Hardening
3.7.2.
IR-Hardening
3.7.3.
Thermal hardening
3.7.4.
Vacuum ovens
3.7.5.
Hotplates
3.8.
Press-fit insertion equipment
3.9.
Depaneling machines
3.10.
Repair and rework stations
3.10.1.
BGA/SMT reworksystems
3.10.2.
PCB track control and repair stations
3.11.
Welding equipment
4.1.
Optical inspection stations
4.1.1.
Automatic optical inspection (AOI)
4.1.1.1.
Solder paste AOI
4.1.1.2.
Assembly AOI
4.1.2.
Manual optical inspection
4.1.2.1.
Magnifier lamps
4.1.2.2.
Microscopes
4.1.3.
PCB inspection systems
4.1.4.
Surface measuring system
4.1.4.1.
Laser profilometer
4.1.4.2.
Roughness measurement systems
4.1.4.3.
Flatness measurement systems
4.1.5.
Film thickness measuring device
4.2.
Electrical inspection
4.2.1.
Component test equipment
4.2.2.
Probe card analyzer, probes, probe cards
4.2.3.
PCB test equipment
4.2.4.
Assembly test equipment
4.2.5.
In-circuit test equipment and programs
4.2.6.
Flying probe test equipment
4.2.7.
Function test equipment
4.2.8.
Insulation test equipment
4.2.9.
EMC test equipment
4.2.10.
High frequency measurement equipment
4.2.11.
Hot test for PCB and hybrids
4.2.12.
Test programs
4.2.13.
Other test and balance systems
4.3.
X-ray inspection
4.3.1.
Computer tomography
4.3.2.
Automatic X-ray inspection
4.3.3.
Manual X-ray inspection
4.4.
Ultrasonic sound inspection
4.4.1.
Transducter test systems
4.4.2.
Acustic microscopes
4.5.
Mechanical inspection
4.5.1.
Bonding testers
4.5.2.
Adhesion testers
4.6.
Chemical inspection
4.6.1.
Contaminometers
4.6.2.
Hygrometer
4.6.3.
Oxygen analyzers
4.6.4.
Other analytical/diagnostical equipment
4.7.
Other inspection systems
4.7.1.
Sonar test equipment
4.7.2.
Leakage testers
4.8.
Burn-in systems
4.9.
Test lab equipment
4.10.
Equipment accessories for assembly inspection
4.10.1.
Test pins
4.10.2.
Grinding machines
5.1.
Process and equipment testing
5.1.1.
Optical displacement measurement systems
5.1.2.
Optical amplitude measurement systems for wirebonder
5.1.3.
Bondability tester
5.1.4.
Adhesion testers
5.1.5.
Screen tension measuring devices
5.1.6.
Solderability testers
5.1.7.
Soldering machines control equipment
5.1.8.
Temperature profiler
5.1.9.
Training and testkids
5.2.
Manufacturing execution systems
5.2.1.
Production data acquisition systems
5.2.2.
Machine data acquisition systems
5.3.
Process and quality data mangement
5.4.
Traceability systems
6.1.
Hardness measurement devices
6.2.
Viscosimeter
7.1.
Reliability test equipment
8.1.
Automation and handling equipment
8.1.1.
Component loading equipment
8.1.2.
Handling systems for chips
8.1.3.
Handling equipment and automatic feed
8.1.4.
Machine linking and transport
8.1.5.
Storage devices
8.1.6.
Drives
8.1.6.1.
Direct drives
8.1.6.2.
Linear motors
8.1.6.3.
Linear actuators
8.2.
Cleanroom technologies
8.2.1.
Cleanroom equipment
8.2.2.
Cleanroom materials
8.2.3.
Flow boxes
8.3.
Workplace furniture
8.3.1.
Assembly benches
8.3.2.
Magnifier
8.3.3.
Lamps
8.4.
ESD-Protection
8.4.1.
Anti-static work places
8.4.2.
ESD - clothing
8.4.3.
ESD - packaging, storage, shipping
8.4.4.
ESD - other products
8.5.
Storage
8.5.1.
Dry storage systems
8.5.2.
Storage systems under nitrogen atmosphere
8.5.3.
Vacuum storage sytems
8.5.4.
Cooling cabinets
8.5.5.
Heating cabinets
8.6.
Magazines and containers
8.6.1.
Plastic magazines and containers
8.6.2.
Metal magazines and containers
8.6.3.
Vacuum boxes
8.7.
Packaging
8.7.1.
Carrier/blister tapes
8.7.2.
Packaging material
8.7.3.
Desiccants
8.7.4.
Humidity indicator cards
8.8.
Cleaners
8.8.1.
Stencil cleaners
8.8.2.
PCB cleaners
8.8.3.
Plastic cleaners
8.9.
Cleaning and recycling systems
8.9.1.
Plasma cleaning systems
8.9.2.
Dry ice jet cleaner
8.9.3.
Other cleaning devices
8.9.4.
Waste water recycling equipment
8.9.5.
Nobel metal recycling euipment
8.9.6.
Filtration apparatus
8.9.7.
Ionization devices
8.10.
Environment and occupational safety
8.10.1.
Solder recovery
8.10.2.
Exhaust systems
8.10.3.
Solder vapour extraction systems
8.10.4.
Filters
8.10.5.
Solder fume exhaust systems
8.10.6.
Gas purification and flux condensing units
8.10.7.
Fan/ventilators
9.1.
Cable
9.2.
Line sets
9.3.
Cable assembly
9.3.1.
Insulation stripping tools and machines
9.3.2.
Crimping machines
9.3.3.
Cable assembly machines
9.3.4.
Cable hardness sheating machines
9.3.5.
Cable marking systems
10.1.
Thermal interface materials
10.2.
Cooler
10.3.
Fan/ventilators
10.4.
Other components
11.1.
3D MID
11.2.
Power hybrids
11.3.
Passive components
11.3.1.
Capacitors
11.3.2.
Coils
11.3.3.
Resistors
11.3.4.
Quartz oscillators
11.3.5.
Fuses/Fuseholders
11.3.6.
Resonators
11.4.
Switches and relays
11.4.1.
Relays
11.4.2.
Switches
11.4.3.
Code switches
11.4.4.
Other switches
11.5.
Film circuits
11.5.1.
Thickfilm devices
11.5.2.
Thinfilm devices
11.5.3.
Hybrid modules
11.6.
Interconnection devices
11.6.1.
Cables
11.6.2.
Plugs
11.6.3.
Sockets
11.6.4.
Connectors
11.6.5.
Contact elements
11.6.6.
Coupler
11.7.
Displays
11.7.1.
Display systems
11.7.2.
LC Displays and modules
11.7.3.
Plasma displays
11.7.4.
Touch screen systems
11.7.5.
Other displays
11.8.
Key boards and input devices
11.9.
Batteries and holders
11.9.1.
Batteries
11.9.2.
Battery holders
11.10.
Ceramic devices
11.11.
Dummy components
11.12.
Housing
11.12.1.
Enclosures for electronics
11.12.2.
Sensor packages
11.12.3.
Housing for microsystems
11.12.4.
Thermal management packages
11.12.5.
Hybrid housing
11.12.6.
Ceramic packagings
11.12.7.
Metal top cover
11.12.8.
Ball grid arrays
11.12.9.
PAL, PLD, FPGA
11.12.10.
Pin-Grid arrays
11.13.
RF-Transponders
12.1.
Design
12.1.1.
System design tools
12.1.2.
Layout systems
12.1.3.
Placing systems
12.1.4.
CAD/CAM software
12.1.5.
CAE/CAD tools
12.1.6.
Components library
12.2.
Simulation
12.2.1.
Electrical simulation tools
12.2.2.
Thermal simulation tools
12.2.3.
Thermo-mechanical simulation tools
12.2.4.
Logic simulators
12.2.5.
ASIC simulators
12.3.
Programming
12.3.1.
Programming tools
12.3.2.
In-Circuit programmers
12.4.
Test
12.4.1.
Test pattern generators
13.1.
Circuit contract development
13.1.1.
ASIC design
13.1.2.
PCB assembly design/hardware design
13.1.3.
Software design
13.1.4.
Designs
13.1.5.
Circuit optimization
13.1.6.
Design of hybride circuits
13.2.
Simulation and test
13.2.1.
Electrical simulation service
13.2.2.
Thermal simulation service
13.2.3.
Thermo-mechanical simulation service
13.3.
Audits
13.3.1.
ESD Audit
14.1.
Electronic Manufacturing Services
14.1.1.
Surface pretreatment
14.1.1.1.
Plating of substrates
14.2.
PCBs
14.2.1.
Photo plotter service
14.3.
Component preparation
14.3.1.
Taping and reeling
14.3.2.
SMD Taping
14.3.3.
Cutting, bending, forming
14.4.
Wafer level packaging
14.4.1.
Wafer thinning
14.4.2.
Wafer level redistribution
14.4.3.
Wafer bumping
14.4.4.
Chip size packaging (CSP)
14.4.5.
Semiconductor interconnections
14.4.6.
Semiconductor housing
14.5.
Assembly
14.5.1.
SMD assembly
14.5.2.
Chip on Board assembly
14.5.3.
Chip on Flex assembly
14.5.4.
Flip Chip assembly
14.5.5.
Chip on Glas assembly
14.5.6.
Hybrid/SMD assembly
14.5.7.
Smart Card Packaging
14.6.
Processing of film circuits
14.6.1.
Thick film hybrids
14.6.2.
Thin film circuits
14.7.
Laser machining
14.7.1.
Laser drilling
14.7.2.
Laser cutting
14.7.3.
Laser trimming
14.8.
Encapsulation
14.8.1.
Molding
14.8.2.
Potting
14.8.3.
Glob top
14.8.4.
Dam & Fill
14.8.5.
Hermetic packaging
14.9.
Contract cleaning
14.10.
Cable hardness assembly
14.10.1.
Cable confection service
14.10.2.
Cable harness sheating service
14.10.3.
Cable marking systems
14.10.4.
Crimp services
14.11.
Assembly inspection and testing services
14.11.1.
Testhouses
14.11.2.
AOI Service
14.11.3.
AXI Service
14.11.4.
Test program development
14.12.
Sample and smallsize productions
14.13.
Quality assurance and reliability services
14.13.1.
Release testing
14.13.2.
Reliability consulting
14.13.3.
Failure analysis
14.13.4.
Calibration services
14.14.
Rework Services
15.1.
Research Institutes
15.1.1.
R & D of electronic material
15.1.2.
Technology R & D
15.1.2.1.
R & D for wafer level packaging
15.1.2.2.
R & D for chip interconnection technologies
15.1.2.3.
R & D for substrate technologies/embedding
15.1.2.4.
R & D for 3D circuit carrier
15.1.2.5.
R & D for optical interconnects
15.1.2.6.
R & D for encapsulation
15.1.3.
Reliability R & D
15.1.4.
R & D for system design
15.1.5.
R & D for production engineering
15.2.
Consulting and Training
16.1.
Used SMT-Equipment
17.1.
Literature
