SMT Hybrid Packaging - Forum

At the forum for panel discussions as well as at the forum for vendor presentations, SMT Hybrid Packaging 2013 offers a diverse, professional supporting program. For many visitors, the forum is one of the highlights where they get a perfect overview on recent trends and product developments.

Schedule

6 - 8 April May 2014, daily from 10:00 - 17:00 hrs. 

Free Admission

For visitors, exhibitors and conference delegates.

 

Premises

Forum within the exhibition hall with about 60 seats.

The program of 2014 will be published here from mid of March 2014

For your preliminary reference:
Download Forum Program SMT Hybrid Packaging 2013

If questions occur please contact Ms. Michaela Maile, phone +49 711 61946-12.