SMT Hybrid Packaging - Forum

At the forum for panel discussions as well as at the forum for vendor presentations, SMT Hybrid Packaging 2013 offers a diverse, professional supporting program. For many visitors, the forum is one of the highlights where they get a perfect overview on recent trends and product developments.

Schedule

16 - 18 April 2013, daily from 10:00 - 17:00 hrs. 

Free Admission

For visitors, exhibitors and conference delegates.

 

Premises

Forum within the exhibition hall with about 60 seats.

The program of 2013 will be published here from middle of February 2013

For your preliminary reference:
Download Forum Program SMT Hybrid Packaging 2012

If questions occur please contact Ms. Michaela Maile, phone +49 711 61946-12.