Welcome to SMT Hybrid Packaging 2014
SMT Hybrid Packaging is Europe´s leading event on System Integration in Micro Electronics.
It is the ideal platform for the industry's leading companies to show the latest trends and developments as well as up-to-date solutions. With 32% foreign exhibitors, the event offers not only a wide, but also an international spectrum. Present your solutions to numerous trade visitors!
Suppliers of the SMT-industry offer products, solutions and services in the field of Electronic Manufacturing. Find out more about the exhibition topics’ spectrum in detail.
In 2014, the EIPC (European Institute of Printed Circuits) will be hosting the 13th Electronic Circuits World Convention (ECWC13) in cooperation with Mesago Messe Frankfurt GmbH. The event will take place in Nuremberg, Germany, from 7 - 9 May alongside SMT Hybrid Packaging which will take place from 6 - 8 May.