06. - 08.05.2014
Nuremberg
SMT Hybrid Packaging 2014
System Integration in Micro Electronics

 
 
 
 
 
 
 
 
 
ECWC13 Call for Papers online
 
 
 
ECWC13 welcomes papers along the entire packaging and PCB production chain.

Topics

Submission

 
SMT Hybrid Packaging 2013 with positive results
 
 
 
A growth of more than 20% compared to 2012 confirmed the new concept of the SMT Hybrid Packaging conference.