Welcome to SMT Hybrid Packaging 2013
SMT Hybrid Packaging is Europe´s largest event on System Integration in Micro Electronics.
It is the ideal platform for the industry's leading companies to show the latest trends and developments as well as up-to-date solutions. With 32% foreign exhibitors, the event offers not only a wide, but also an international spectrum. Present your solutions to numerous trade visitors!
Exhibition topicsSupplier of the SMT-industry offer products, solutions and services in the field of Electronic Manufacturing. Find out more about the exhibition topics’ spectrum in detail.
ConferenceThe SMT Hybrid Packaging conference is the most important platform for information and networking in the field of micro electronics assembly in Europe.
