Lectures / Presentations
The vendor presentations will be held on a forum within the exhibition hall. Exhibitors will have the opportunity to show their product news to a qualified audience.
In 2014, the 13th Electronic Circuits World Convention (ECWC13) will take place conjunction with SMT Hybrid Packaging 2014. Its topics will focus on electronic equipment and PCB manufacturing, set against a background of knowledge of the global demand, new processes and technologies required, and the changing market dynamics. Other SMT Hybrid Packaging topics will also be addressed.