16. - 18.04.2013
Nuremberg
SMT Hybrid Packaging 2013
System Integration in Micro Electronics

 
 
 

SMT Hybrid Packaging – Exhibition Topics
 

The SMT Hybrid Packaging shows the complete spectrum on System Integration in Micro Electronics. This international meeting point in the field of electronic manufacturing offers the latest products, services and solutions. From Assembly, PCB, Soldering to Test - the complete market overview under one roof. 

 

  • Assembly
  • Components 
  • Design and Development
  • EMS
  • PCB production 
  • Packaging
  • Screen Printing
  • Soldering
  • Test Systems
    and many more 
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