SMT/HYBRID/PACKAGING - Facts & Figures
Exhibitor target group: - Industry's leading companies on System Integration in Micro Electronics - Modern Production, Electronic Systems, Design and Development, Components, PCB, Test Systems, Packaging and Basis Materials, Machinery, Apparatus, Automobile Engineering, Information and Communication Technology, Advanced Packaging, ASICs, Automatic Placement Machines, BGAs, Board Design, CAE, FPGAs, Hybrids, Soldering, MCM, PCBs, Test, Screen Printing, SMD / SMT, Test Equipment, Materials, etc.
Visitor target groups: - international qualified audience - Chemical Industry, Machinery, Apparatus, Automobile Industry, Parts for Air and Spacecraft, Electrical Enginering, Electronics, Semiconductor Production, Manufacturing Electronics, Micro Electronics, PCBs, SMT-Assembly, SMT-Soldering, Opto Electronics, Precision Engeneering, Optics, Micro System Technologies, Computers & Networks, Factory Automation, CAD in Electronics, Quality Assurance, Automation Control, etc.
Results of SMT/HYBRID/PACKAGING 2009
| Exhibition area Main exhibitors/Partner companies Represented companies Visitors Conference attendees | 26,500 | sqm |
Visitors
21,253 qualified, international audience - 16,151 (76%) from Germany,
5,102 (24%) international.
The figures for exhibitors and visitors are checked and certified by the Society for Voluntary Control of Fair and Exhibition Statistics (FKM), Berlin.
