Conference
IGBT – Integrated Power Modules
Schedule
Description
| Chairman: Eric Lan, Fairchild Semiconductor, Taiwan | ||
| 13:00 | Reliability of Spring Pressure Contacts in Power Electronics The connection between a power module and the load and control contacts on the printed circuit board is an important feature for both reliability and ease of assembly. An especially advantageous solution is the use of multiple spring contacts, because it requires no solder or screw process during assembly and the positioning of the springs on the DBC can be freely chosen. Spring are no new development in electrical contacts, yet the spring characteristics of some electrical contact systems are not as well defined as those for power modules. | |
| 13:30 |
| New Generation of IPM for Home Appliance Application: Focusing on Efficiency and Reliability The new generation of Integrated Power Module (IPM) is introduced for home appliances. The combined benefits of new Trench IGBTs and optimized package design have enabled us to achieve higher efficiency and improved reliability. |
14:00 |
| Advanced Neutral Point-Clamped (ANPC) IGBT module Though many kind of power conversion method were used to the applications, three-level inverter system was also widely used in many application, because of its high-output voltage, or better waveform efficiency as features. On the other hand, three-level inverter system has demerit of many semiconductor switch, and complicated control system/method. In order to solve the problem, Advanced Neutral Point-Connection (ANPC) inverter system was suggested. |


