Keynote

Wednesday, 20.06.2012, 12:15 - 13:00 hrs

English

Power Electronics play an ever increasing role in generation, distribution, and efficient use of electrical energy. Therefore power semiconductor devices and how to package them has become a key enabling technology. The thrive for high power densities and higher temperatures, for higher availability and reliability, for better suitability for harsh environments, and, last but not least, for lower cost has not lead to a convergence of form, fit and function of power modules, but quite contrary, to a full basket of new and exciting technologies and materials for die attach, cooling, chip contacting, terminal attachment and encapsulation which can confuse users of power modules. This key note aims at reviewing the latest technologies and material trends for medium to high power modules and to put their pros and cons in perspective for their intended use. The presentation will finish with on an outlook for research and development on how to package wide band gap power semiconductors for medium to high power applications.